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NOTE: “Note” contains general information that relates to your safe maintenance service. Improper repair of the computer may result in safety hazards. Toshiba requires service technicians and authorized dealers or service providers to ensure the following safety precautions are adhered to strictly.
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The manual is divided into the following parts: Chapter 1 Hardware Overview describes Satellite A50S/TECRA A3X series system unit and each FRU. Chapter 2 Troubleshooting Procedures explains how to diagnose and resolve FRU problems. Chapter 3 Test and Diagnostics describes how to perform test and diagnostic operations for maintenance service.
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Conventions This manual uses the following formats to describe, identify, and highlight terms and operating procedures. Acronyms On the first appearance and whenever necessary for clarification acronyms are enclosed in parentheses following their definition. For example: Read Only Memory (ROM) Keys Keys are used in the text to describe many operations.
Table of Contents Chapter 1 Hardware Overview Features ........................1-1 System Block Diagram ....................1-6 3.5-inch USB Floppy Disk Drive................1-10 2.5-inch Hard Disk Drive..................1-11 CD-ROM Drive ....................... 1-13 DVD-ROM Drive ....................1-15 DVD-ROM & CD-R/RW Drive ................1-18 DVD Super Multi Drive...................
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2.13 Sound Troubleshooting.................... 2-45 2.14 Wireless LAN Troubleshooting................2-47 Chapter 3 Tests and Diagnostics The Diagnostic Test ....................3-1 Executing the Diagnostic Test ................... 3-4 Setting of the hardware configuration................ 3-8 Heatrun Test......................3-11 Subtest Names......................3-12 System Test......................3-14 Memory Test......................
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3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program ..........3-70 3.30 Sound Test program....................3-84 3.31 SETUP ........................3-90 Chapter 4 Replacement Procedures Overview........................4-1 Battery Pack/PC Card ....................4-8 Memory Module ...................... 4-11 MDC ........................4-14 HDD......................... 4-16 Wireless LAN Card....................4-19 Cooling Fin/CPU ..................... 4-21 Keyboard........................
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Appendix C Pin Assignment ..................C-1 Appendix D Keyboard Scan/Character Codes ............... D-1 Appendix E Key Layout....................E-1 Appendix F Wiring Diagrams..................F-1 Appendix G BIOS/KBC/EC Update ................G-1 Appendix H Reliability....................H-1 Satellite A50S /TECRA A3X Maintenance Manual (960-534) [CONFIDENTIAL]...
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1 Hardware Overview Chapter 1 Contents Features ........................1-1 System Block Diagram ....................1-6 3.5-inch USB Floppy Disk Drive................1-10 2.5-inch Hard Disk Drive..................1-11 CD-ROM Drive ....................... 1-13 DVD-ROM Drive ....................1-15 DVD-ROM & CD-R/RW Drive ................1-18 DVD Super Multi Drive................... 1-21 Keyboard........................
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1 Hardware Overview Figures Figure 1-1 Front of the computer..................1-4 Figure 1-2 System units configuration ................1-5 Figure 1-3 System block diagram..................1-6 Figure 1-4 3.5-inch USB FDD..................1-10 Figure 1-5 2.5-inch HDD....................1-11 Figure 1-6 CD-ROM Drive ................... 1-13 Figure 1-7 DVD-ROM Drive ..................
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1 Hardware Overview Table 1-18 Time required for charges of RTC battery........... 1-32 Table 1-19 AC adapter specifications ................1-33 Satellite A50S/TECRA A3X Maintenance Manual (960-534) [CONFIDENTIAL]...
1.1 Features 1 Hardware Overview Features Features The Satellite A50S/TECRA A3X is a high performance all-in-one PC running a Pentium M or Celeron M processor. Features are listed below. Microprocessor [CPU Easy Replaceable] Microprocessor used is different from each model. ®...
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1 Hardware Overview 1.1 Features VRAM The computer has VGA imbedded in North Bridge and VRAM in 128MB(max). Keyboard An easy-to-use 85(US)-/86(UK)-key keyboard. Windows key is supported. The keyboard also supports touchpad as a pointing device. Optical devices A CD-ROM, DVD-ROM, DVD-ROM & CD-R/RW or DVD Super Multi (supporting Double Layer) Drive is supported.
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1.1 Features 1 Hardware Overview LAN/MODEM Connectors for LAN and Modem are separately mounted. The port enables connection of an external monitor. Docking interface port Advanced Port Replicator III can be connected through docking port on the bottom. Satellite A50S/TECRA A3X Maintenance Manual (960-534) [CONFIDENTIAL]...
1 Hardware Overview 1.1 Features Figure 1-1 shows the front of the computer. Figure 1-1 Front of the computer [CONFIDENTIAL] Satellite A50S/TECRA A3X Maintenance Manual (960-534)
1.1 Features 1 Hardware Overview Figure 1-2 shows the system units configuration. Figure 1-2 System units configuration Satellite A50S/TECRA A3X Maintenance Manual (960-534) [CONFIDENTIAL]...
1 Hardware Overview 1.2 System Block Diagram System Block Diagram Figure 1-3 shows the system block diagram. Figure 1-3 System Block Diagram [CONFIDENTIAL] Satellite A50S/TECRA A3X Maintenance Manual (960-534)
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1.2 System Block Diagram 1 Hardware Overview The PC contains the following components. ® ® Intel Mobile Pentium -M model Pentium-M 1.60GHz (Processor Number ; 730) 1.73GHz (Processor Number ; 740) 1.86GHz (Processor Number ; 750) 2.00GHz (Processor Number ; 760) 2.13GHz (Processor Number ;...
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1 Hardware Overview 1.2 System Block Diagram Chipset This gate array has the following elements and functions. North Bridge (Intel 915GM <Express Chipset>) - Support Pentium-M(915GM)/Celeron-M(915GM/910GML) Processor System Bus - System Memory Interface - Memory Controller : DDR333/DDR2-400/DDR2-533, 2GB(max) - Graphics I/F : x16 PCI Express Based Graphics I/F - DMI (Direct Media Interface) - Integrated Display interface - 1,257-ball 40.0mmx37.5mmx2.6mm FC-BGA Package...
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VGA controller Imbedded in North Bridge Other main system chips • EC/KBC (M306KAFCLRP x 1) • PSC (Toshiba-made TMP86PM49UG x 1) • Thermal sensor (AnalogDevice-made ADM1032 x 1) • Audio AMP (Mitsumi-made MM1517X x1) • AC97-CODEC (SigmaTel-made STAC9750TG x1) •...
1 Hardware Overview 1.3 3.5-inch USB Floppy Disk Drive 3.5-inch USB Floppy Disk Drive This compact, lightweight and high-reliability FDD can be used with 720KB and 1.44MB floppy disks. Figure 1-4 shows the 3.5-inch FDD. Table 1-1 lists the specifications. Figure 1-4 3.5-inch USB FDD Table 1-1 3.5-inch USB FDD specifications Item...
Figure 1-5 shows a view of the 2.5-inch HDD and Tables 1-2 and 1-3 list the dimensions and specifications. Figure 1-5 2.5-inch HDD Table 1-2 2.5-inch HDD dimensions (1/2) Standard Item TOSHIBA HDD2193VZK01 HDD2194VZK01 HDD2191VZK01 Width (mm) 69.85 Height (mm) Depth (mm) 100.0...
1.5 CD-ROM Drive 1 Hardware Overview CD-ROM Drive The CD-ROM drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CD. It is a high-performance drive that reads at maximum 24-speed. The CD-ROM drive is shown in Figure 1-6. The specifications of the CD-ROM drive are described in Table 1-4 and 1-5.
1.6 DVD-ROM Drive 1 Hardware Overview DVD-ROM Drive The DVD-ROM drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CD, CD- R/RW and DVD. It is a high-performance drive that reads DVD at maximum 8-speed, and reads CD at maximum 24-speed (3,600 KB per second). The DVD-ROM drive is shown in Figure 1-7.
1 Hardware Overview 1.7 DVD-ROM & CD-R/RW Drive DVD-ROM & CD-R/RW Drive The DVD-ROM & CD-R/RW drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15- inch) CD, CD-R/RW and DVD. It is a high-performance drive that reads DVD at maximum 8-speed, and reads CD at maximum 24-speed.
1.8 DVD Super Multi drive 1 Hardware Overview DVD Super Multi drive The DVD Multi drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CD, CD- R/RW and DVD. It is a high-performance drive that reads CD at maximum 24-speed (3,600 KB per second) and writes DVD-RW at 2-speed, DVD-RAM at 2-speed, DVD-R at4-speed, DVD+R at 2.4-speed and DVD+RW at 2.4-speed.
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1 Hardware Overview 1.8 DVD Super Multi drive Table 1-11 DVD Super Multi drive specifications (1/2) Specifications Items Panasonic (G8CC0002T220) DVD-ROM MAX 8x CAV Read(KB/s) CD-ROM MAX 24x CAV CD-R 24x (ZoneCLV) CD-RW 4x (CLV) High Speed CD-RW 10x (CLV) Ultra Speed CD-RW 10x (CLV) DVD-R 8x (ZoneCLV) Transfer Speed...
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1.8 DVD Super Multi drive 1 Hardware Overview Table 1-11 DVD Super Multi drive specifications (2/2) Specifications Items TEAC (G8CC0002S220) DVD-ROM 8x (CAV) Read(KB/s) CD-ROM 24x (CAV) CD-R 24x (ZoneCLV) CD-RW 16x (CLV) DVD-R 8x (ZoneCLV) DVD-RW 4x (ZoneCLV) Write Transfer Speed DVD+R 8x (ZoneCLV) DVD+R Double Layer 2.4x (CLV)
1 Hardware Overview 1.9 Keyboard Keyboard An 85(US)-/86(UK)- key keyboard is mounted on the system unit. The keyboard is connected to membrane connector on the system board and controlled by the keyboard controller. Figure 1-10 shows a view of the keyboard. See Appendix E for details of the keyboard layout.
1.10 TFT Color Display 1 Hardware Overview 1.10 TFT Color Display The TFT color display has a 15.0-inch (XGA, SXGA+) LCD module and the FL inverter board. 1.10.1 LCD Module The LCD module used for the TFT color display uses a backlight as the light source and can display a maximum of 262,144 colors with 1,024 x 768 or 1,400 x 1,050 resolution.
1.10 TFT Color Display 1 Hardware Overview 1.10.2 FL Inverter Board The FL inverter board supplies a high frequency current to illuminate the LCD module fluorescent lamp. Table 1-13 lists the FL inverter board specifications. Table 1-13 FL inverter board specifications Item Specifications Voltage (V)
1 Hardware Overview 1.11 Power Supply 1.11 Power Supply The power supply supplies 26 different voltages to the system board. The power supply microcontroller has the following functions. 1. Judges if the DC power supply (AC adapter) is connected to the computer. 2.
1 Hardware Overview 1.12 Batteries 1.12 Batteries The PC has the following two batteries. Main battery Real time clock (RTC) battery Table 1-15 lists the specifications for these two batteries. Table 1-15 Battery specifications Material Output Battery Name Capacity Voltage G71C0003V910 G71C0003VA10 G71C0003VD10...
1.12 Batteries 1 Hardware Overview 1.12.2 Battery Charging Control Battery charging is controlled by a power supply microprocessor. The power supply microprocessor controls power supply and detects a full charge when the AC adaptor and battery are connected to the computer. Battery Charge When the AC adapter is connected, normal charging is used while the system is turned on, and quick charge is used while the system is turned off or in suspend mode.
1 Hardware Overview 1.12 Batteries 1.12.3 RTC Battery The RTC battery provides the power supply to maintain the date, time, and other system information in memory. Table 1-18 lists the Time required for charges of RTC battery. Table 1-18 Time required for charges of RTC battery Condition Time Power ON (Lights Power LED)
1.13 AC Adapter 1 Hardware Overview 1.13 AC Adapter The AC adapter is used to charge the battery. Table 1-19 lists the AC adapter specifications. Table 1-19 AC adapter specifications (1/2) Item Specifications G71C0002SB10 G71C0004A410 Input voltage 100V/240V Input frequency 50Hz/60Hz No load input power 0.5W or less...
2 Troubleshooting Procedures Figures Figure 2-1 Troubleshooting flowchart................2-3 Figure 2-2 A set of tool for debug port test ..............2-18 Tables Table 2-1 Battery icon....................2-6 Table 2-2 DC IN icon..................... 2-6 Table 2-3 D port status ....................2-19 Table 2-4 FDD error code and status ................
2. Phillips screwdrivers NOTE: Be sure to use the PH point size “0” screwdriver complying with the ISO/DIS 8764-1:1996. 3. Toshiba MS-DOS system FD 4. Tester There are following two types of connections in the figure of board and module connection in and after 2.3 Power Supply Troubleshooting.
Before going through the flowchart steps, check the following: ® Make sure that Toshiba Windows OS is installed on the hard disk. Non-Toshiba operating systems can cause the computer malfunction. Make sure all optional equipment is removed from the computer.
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2.2 Troubleshooting Flowchart 2 Troubleshooting Procedures If the diagnostics program cannot detect an error, the problem may be intermittent. The Test program should be executed several times to isolate the problem. Check the Log Utilities function to confirm which diagnostic test detected an error(s), then perform the appropriate troubleshooting procedures as follows: 1.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting Power Supply Troubleshooting The power supply controller controls many functions and components. To determine if the power supply is functioning properly, start with Procedure 1 and continue with the other Procedures as instructed. The procedures described in this section are: Procedure 1: Power Status Check Procedure 2: Error Code Check Procedure 3: Connection Check...
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2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures When the icon is blinking, perform the following procedure. 1. Remove the battery pack and the AC adapter. 2. Re-attach the battery pack and the AC adapter. If the icon is still blinking after the operation above, check the followings: Check 1 If the DC IN icon blinks orange, go to Procedure 2.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting Procedure 2 Error Code Check If the power supply microprocessor detects a malfunction, the DC IN icon blinks orange. The blink pattern indicates an error as shown below. Start Off for 2 seconds Error code (8 bit) “1”...
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2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures DC power supply (AC adapter) Error code Meaning AC Adapter output voltage is over 16.5V. Common Dock output voltage is over 16.5V. Current from the DC power supply is over 7.00A. Current from the DC power supply is over 0.5A when there is no load. Abnormal current has been sensed.
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2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting E5V output (P61) Error code Meaning E5V voltage is over 6.00V when the computer is powered on/off. E5V voltage is 4.50V or less when the computer is powered on. E5V voltage is 4.50V or less when the computer is booting up. E5V voltage is over 4.50V when the computer is powered off.
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2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures PPV output (P65) Error code Meaning PPV voltage is over 1.80V when the computer is powered on/off. PPV voltage is 0.56V or less when the computer is powered on. PPV voltage is 0.56V or less when the computer is booting up. PPV voltage is over 0.56V when the computer is powered off.
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2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting PTV output (P75) Error code Meaning PTV voltage is over 2.16V when the computer is powered on/off. PTV voltage is 0.89V or less when the computer is powered on. PTV voltage is 0.89V or less when the computer is booting up. PTV voltage is 0.89V or more when the computer is powered off.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures Procedure 3 Connection Check The wiring diagram related to the power supply is shown below: Any of the connectors may be disconnected. Perform Check 1. Check 1 Make sure the AC adapter and the AC power cord are firmly plugged into the DC IN 15 V socket and wall outlet.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting Procedure 5 Replacement Check The power is supplied to the system board by the AC adapter. If either the AC adapter or the system board was damaged, perform the following Checks. To disassemble the computer, follow the steps described in Chapter 4, Replacement Procedures.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures System Board Troubleshooting This section describes how to determine if the system board is defective. Start with Procedure 1 and continue with the other procedures as instructed. The procedures described in this section are: Procedure 1: Message Check Procedure 2: Debug Port Check Procedure 3: Diagnostic Test Program Execution Check...
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Procedure 1 Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. The IRT tests each IC on the system board and initializes it. If an error message is shown on the display, perform Check 1.
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2.4 System Board Troubleshooting 2 Troubleshooting Procedures Check 3 The IRT checks the system board. When the IRT detects an error, the system stops or an error message appears. If one of the following error messages (1) through (17), (23) or (24) is displayed, go to Procedure 4.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Procedure 2 Debug Port Check Check the D port status by a debug port test. The tool for debug port test is shown below. Figure 2-2 A set of tool for debug port test The test procedures are follows;...
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2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-3 D port status (1/9) D port Inspection items Details status Enabling address line A20 and Clearing a software reset bit Prohibition of APIC Initializing MCHM Initializing ICHM Initializing Super I/O Initializing debug port Dummy read of 3 Bus data Setting of printer port...
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2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-3 D port status (2/9) D port Inspection items Details status F007H BTBK_ENTER_SYSTEM_BIOS Transition to System BIOS IRT BIOS Rewite process ICHM.D31 Initialization DRAM Configuration Permission of cache () Only for L1 cache MEMORI CLEAR F008H BTBK_INI_MEM_END...
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2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-3 D port status (3/9) D port Inspection items Details status Searching entry of “CHGBIOSA.EXE/CHGFIRMA.EXE” from the loaded sector Loading EXE header of “CHGBIOSA.EXE /CHGFIRMA.EXE”, Key input when an error occurred Executing “CHGBIOSA.EXE”/”CHGFIRMA.EXE” F100H IRT_START Cache controll for HyperThreading...
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2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-3 D port status (4/9) D port Inspection items Details status F103H IRT_RSM_BRANCH Resume branch check Not resuming when a CMOS error occurred (at Cold boot only) Not resuming when status code of resume is not Checking resume error S3 Return error (ICH) Resume error 170H RSM_UNKNOWN_ERR...
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2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-3 D port status (5/9) D port Inspection items Details status F106H IRT_INI_SMBASE_END Initialization of the device Which needs PCI test (at Cold boot only) and Initialization initialization before PCI BUS Initialization Setting test pattern in PIT#0 of Channel 0 Checking whether test pattern set can be read...
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2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-3 D port status (6/9) D port Inspection items Details status Initialization of the device needed AC’97 control initializing before PCI BUS Initialization Initializing information of thermal control Initializing a KBC Turning VGA display off and controlling reset Initializing sound function Acquiring the computer multiple box status HC initialization, Recognition of USB device...
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2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-3 D port status (7/9) D port Inspection items Details Storing of VGA configuration result F10BH IRT_PCI_CONF_END Task generation for waiting PCI_CONFIGURATION completion Initialization of H/W which is necessary Printer port setting (for models supporting after PCI configuration printer port) HDD initialization sequence start...
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2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-3 D port status (8/9) D port Inspection items Details status Setting up the address of font data for resume password Setting up the parameters for character repeat on a USB keyboard Final check of key input during IRT Storing of T_SHADOW_RAM_SIZE Update of system resource before boot...
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2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-3 D port status (9/9) D port Inspection items Details status Updating DMI Wakeup factor and SM- BIOS structure table Closing configuration space of PCI devices Cache control Update of parameter block A Process for CPU Make the CPU clock to be set by SETUP Waiting for the motor off of a disabled HDD...
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Procedure 3 Diagnostic Test Program Execution Check Execute the following tests from the Diagnostic Test Menu. These tests check the system board. Refer to Chapter 3, Tests and Diagnostic, for more information on how to perform these tests.
2.5 3.5” FDD Troubleshooting 2 Troubleshooting Procedures 3.5” FDD Troubleshooting This section describes how to determine if the 3.5” FDD is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required. Procedure 1: FDD Head Cleaning Check Procedure 2: Diagnostic Test Program Execution Check Procedure 3: Connector Check and Replacement Check Procedure 1...
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2 Troubleshooting Procedures 2.5 3.5” FDD Troubleshooting Procedure 2 Diagnostic Test Program Execution Check Insert the Diagnostics Disk in the USB FDD, turn on the computer and run the test. Refer to Chapter 3, Tests and Diagnostics, for more information about the diagnostics test procedures.
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2.5 3.5” FDD Troubleshooting 2 Troubleshooting Procedures Procedure 3 Connector Check and Replacement Check The USB connector may be disconnected from the system board. Check visually that the connector is connected firmly. Check 1 Make sure the following cables and connectors are firmly connected to the each board.
For the backup, refer to the User’s Manual. Procedure 1 Partition Check Insert the Toshiba MS-DOS system disk and start the computer. Perform the following checks: Type C: and press Enter. If you cannot change to drive C, go to Check 2. If Check 1 you can change to drive C, go to Procedure 2.
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2.6 2.5” HDD Troubleshooting 2 Troubleshooting Procedures Procedure 2 Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. When the test detects an error, an error message is displayed on the screen.
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2 Troubleshooting Procedures 2.6 2.5” HDD Troubleshooting Procedure 3 Format Check The computer’s HDD is formatted using the MS-DOS FORMAT program or the physical format program of the test program. To format the HDD, start with Check 1 below and perform the other steps as required.
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2.6 2.5” HDD Troubleshooting 2 Troubleshooting Procedures Procedure 4 Diagnostic Test Program Execution Check The HDD test program is stored in the Diagnostics Disk. Perform all of the HDD tests in the Hard Disk Drive Test. Refer to Chapter 3, Tests and Diagnostics, for more information about the HDD test program.
2 Troubleshooting Procedures 2.6 2.5” HDD Troubleshooting Procedure 5 Connector Check and Replacement Check The HDD is connected to the connector of the system board. The connecting portion may be disconnected. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform the following checks to check the connecting portion: Check 1...
2.7 Keyboard Troubleshooting 2 Troubleshooting Procedures Keyboard Troubleshooting To determine if the computer’s keyboard is functioning properly, perform the following procedures. Start with Procedure 1 and continue with the other procedures as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check...
2.8 Display Troubleshooting 2 Troubleshooting Procedures Procedure 3 Connector and Cable Check LCD Module is connected to system board by an LCD/FL cable. FL inverter board is also connected to system board by an LCD/FL cable. In addition, fluorescent lamp is connected to FL inverter board by HV cable.
2 Troubleshooting Procedures 2.8 Display Troubleshooting Procedure 4 Replacement Check Fluorescent lamp, FL inverter, LCD module, HV cable and LCD/FL cable are connected to display circuits. Any of these components may be faulty. Refer to Chapter 4, Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks: If fluorescent lamp does not light, perform Check 1.
2.9 Touch Pad Troubleshooting 2 Troubleshooting Procedures Touch Pad Troubleshooting To determine whether the Touch Pad is faulty or not, perform the following procedures: Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector and Cable Check Procedure 1 Diagnostic Test Program Execution Check Execute the Touch pad test (ONLY ONE TEST) in the Diagnostic Program.
2 Troubleshooting Procedures 2.10 Optical Drive Troubleshooting 2.10 Optical Drive Troubleshooting To check if the optical drive is defective or malfunctioning, follow the troubleshooting procedures below as instructed. Procedure 1 Diagnostic Test Program Execution Check Procedure 2 Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the CD-ROM/DVD-ROM Test in the Diagnostic Program.
2.11 Modem Troubleshooting 2 Troubleshooting Procedures 2.11 Modem Troubleshooting To check if the modem is defective or malfunctioning, follow the troubleshooting procedures below as instructed. Procedure 1 Diagnostic Test Program Execution Check Procedure 2 Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute Modem test in the LAN/Modem/Bluetooth/IEEE1394 test program.
2 Troubleshooting Procedures 2.12 LAN Troubleshooting 2.12 LAN Troubleshooting To check if the computer’s LAN is defective or malfunctioning, follow the troubleshooting procedures below as instructed. Procedure 1 Diagnostic Test Program Execution Check Procedure 2 Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute LAN test in the LAN/Modem/Bluetooth/IEEE1394 test program.
2.13 Sound Troubleshooting 2 Troubleshooting Procedures 2.13 Sound Troubleshooting To check if the sound function is defective or malfunctioning, follow the troubleshooting procedures below as instructed. Procedure 1 Diagnostic Test Program Execution Check Procedure 2 Connector Check Procedure 3 Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Sound Test in the Diagnostic Program.
2 Troubleshooting Procedures 2.13 Sound Troubleshooting Procedure 3 Replacement Check Check 1 The speaker may be faulty. Replace it with a new one following the steps in Chapter 4. If the problem persists, perform Check 3. Check 2 The sound board may be faulty. Replace it with a new one following the steps in Chapter 4.
2.14 Wireless LAN Troubleshooting 2 Troubleshooting Procedures 2.14 Wireless LAN Troubleshooting To check if the computer's Wireless LAN is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Transmitting-Receiving Check Procedure 2: Antennas' Connection Check Procedure 3: Replacement Check Procedure 1 Transmitting-Receiving Check Before starting the test, make sure the wireless communication switch is set in the ON...
2 Troubleshooting Procedures 2.14 Wireless LAN Troubleshooting Check 3 Make sure the wireless LAN antenna cables (MAIN and AUX) are firmly connected to the connectors on the wirelss LAN card. If the wireless LAN antenna cables are disconnected, connect them firmly and perform Procedure 1.
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3 Tests and Diagnostics Chapter 3 Contents The Diagnostic Test ....................3-1 3.1.1 Diagnostics menu ................. 3-1 3.1.2 H/W (Hardware) initial information setting tool........3-3 3.1.3 Heatrun test program................3-3 Executing the Diagnostic Test ................... 3-4 3.2.1 Diagnostics menu (T&D) ..............3-4 3.2.2 H/W initial information setting tool .............
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3 Tests and Diagnostics 3.21.2 Operations ..................3-46 3.22 Log Utilities ......................3-47 3.22.1 Function Description ................3-47 3.22.2 Operations ..................3-48 3.23 Running Test......................3-49 3.23.1 Function Description ................3-49 3.23.2 Operations ..................3-49 3.24 Floppy Disk Drive Utilities..................3-50 3.24.1 Function Description ................
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3 Tests and Diagnostics Tables Table 3-1 Subtest names ....................3-12 Table 3-2 Error codes and error status names ..............3-35 Table 3-3 Hard disk controller status register contents............3-38 Table 3-4 Error register contents..................3-39 Table 3-5 Error message..................... 3-76 Table 3-6 Error code for Bluetooth test (BD_ADDR) ............
3 Tests and Diagnostics 3.1 The Diagnostic Test The Diagnostic Test This chapter explains how to use the Diagnostic Test programs to test the functions of the computer’s hardware modules. The Diagnostics Programs are stored on some Diagnostic Disks. There are Service Program Modules (DIAGNOSTIC MENU) and the Test Program Modules (DIAGNOSTIC TEST MENU) on the Diagnostic Disk.
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A cleaning kit to clean the floppy disk drive heads (Head Cleaning) An external display supporting monitor ID (Expansion test) A CD test media TOSHIBA CD-ROM TEST DISK or ABEX TEST CD-ROM (Sound test) A DVD test media (DVD-ROM TEST DISK TSD-1) (Sound test)
3 Tests and Diagnostics 3.1 The Diagnostic Test 3.1.2 H/W (Hardware) initial information setting tool The H/W initial information setting tool consists of the following programs. Initial configuration Region write System configuration display E2PROM test (MAC/GUID/DMI) You will need the following equipment to perform some of the programs. The Diagnostics Disk (Main T&D) A LAN wraparound connector (E2PROM test) 3.1.3 Heatrun test program...
3.2.1 Diagnostics menu (T&D) After pressing 1 and Enter in the startup menu, the following menu appears. TOSHIBA personal computer XXXXXX DIAGNOSTICS version X.XX (c) copyright TOSHIBA Corp. 20XX DIAGNOSTICS MENU : 1 - DIAGNOSTIC TEST 2 – ONLY ONE TEST...
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Set the highlight bar to 1, and press Enter. The following DIAGNOSTIC TEST MENU will appear: TOSHIBA personal computer XXXXXX DIAGNOSTICS version X.XX (c) copyright TOSHIBA Corp. 20XX DIAGNOSTIC TEST MENU : 1 - SYSTEM TEST 2 - MEMORY TEST...
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3.2 Executing the Diagnostic Test 3 Tests and Diagnostics Select the option you want to execute and press Enter. When you select 1- SYSTEM TEST, the following message will appear: SYSTEM TEST NAME XXXXXX xxxxxxx DIAGNOSTIC TEST VX.XX [Ctrl]+[Break] ; test end [Ctrl]+[C] ;...
3 Tests and Diagnostics 3.2 Executing the Diagnostic Test Use the up and down arrow keys to move the cursor to “ERROR STOP”. Use the right and left arrow keys to move the cursor to the desired option and press Enter. Selecting YES of ERROR STOP stops the test program when an error is found and displays the operation guide on the right side of the display screen as shown below: ERROR STATUS NAME...
3.3 Setting of the hardware configuration 3 Tests and Diagnostics Setting of the hardware configuration To execute this program, select 2-Repair initial config test in the startup menu, press Enter and follow the directions on the screen. The H/W initial information setting tool consists of four subtests.
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3 Tests and Diagnostics 3.3 Setting of the hardware configuration Setting of the HWSC Setting of the UUID Display of the DMI information (including UUID) Setting of DVD region code (Yes/No) After completion of the above settings, H/W configuration & DMI information are appeared in order.
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3.3 Setting of the hardware configuration 3 Tests and Diagnostics Subtest 08 System configuration display This subtest displays the information of the system configuration. Confirm the contents and press Enter. For more details on the system configuration information, refer to 3.26 "System configuration".
3 Tests and Diagnostics 3.4 Heatrun Test Heatrun Test To execute this program, select 3-Repair heatrun in the startup menu, press Enter. After selecting this test, the same subtests as 3.24 RUNNING TEST is executed successively. For more details on the procedure and test content, refer to RUNNING TEST. When the heatrun test ends, following message appears in the display.
3.5 Subtest Names 3 Tests and Diagnostics Subtest Names Table 3-1 lists the subtest names for each test program in the DIAGNOSTIC TEST MENU. Table 3-1 Subtest names (1/2) Test Name Subtest No. Subtest Name SYSTEM ROM checksum Fan ON/OFF Geyserville Quick charge DMI read...
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3 Tests and Diagnostics 3.5 Subtest Names Table 3-1 Subtest names (2/2) Test Name Subtest No. Subtest Name PRINTER Ripple pattern [Not supported] Function Wrap around FIR/SIR Point to point (send) ASYNC [Not supported] FIR/SIR Point to point (receive) Wrap around (board) HARD DISK Sequential read Address uniqueness...
3.6 System Test 3 Tests and Diagnostics System Test To execute the System Test select 1 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter.
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3 Tests and Diagnostics 3.6 System Test This subtest checks the status for the quick charge. Subtest 05 DMI read This subtest displays the information in the Flash-ROM in the following format. *** DMI Data Display Ver X.XX *** Model Name : XXXXXXXXXXX Version Number : XXXXXXXXXXXX...
3.7 Memory Test 3 Tests and Diagnostics Memory Test To execute the Memory Test, select 2 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter.
3 Tests and Diagnostics 3.8 Keyboard Test Keyboard Test To execute the Keyboard Test, select 3 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter.
3.9 Display Test 3 Tests and Diagnostics Display Test To execute the Display Test, select 4 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter.
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3 Tests and Diagnostics 3.9 Display Test Subtest 04 Gradation & Mode test for VGA This subtest displays gradations for following modes. To change the mode, press Enter. [Mode 12] [Mode 13] [Mode 3] [Mode 111 640*480 64K] [Mode 112 640*480 16M] [Mode 114 800*600 64K]...
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3.9 Display Test 3 Tests and Diagnostics Subtest 06 “H” Pattern Display This subtest displays a full screen of “H” patterns. HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH To exit this subtest and return to the DISPLAY TEST menu, press Enter. NOTE: The last row may not be completely filled.
3 Tests and Diagnostics 3.10 Floppy Disk Test 3.10 Floppy Disk Test CAUTION: Before running the floppy disk test, prepare a formatted work disk. Remove the Diagnostics Disk and insert the work disk into the FDD. The contents of the floppy disk will be erased. To execute the Floppy Disk Test, select 5 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions displayed on the screen.
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3.10 Floppy Disk Test 3 Tests and Diagnostics Select the number of the subtest you want to execute and press Enter. The following message will appear during the floppy disk test. xxx DIAGNOSTIC TEST VX.XX FLOPPY DISK IN PROGRESS XXXXXXX [Ctrl]+[Break] : test end [Ctrl]+[C]...
3 Tests and Diagnostics 3.11 Printer Test 3.11 Printer Test To execute the Printer Test, select 6 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. The following messages will appear after selecting the Printer Test from the DIAGNOSTIC TEST MENU. Answer each of the questions with an appropriate response to execute the test.
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3.11 Printer Test 3 Tests and Diagnostics Subtest 02 Function This subtest is for IBM compatible printers, and tests the following functions: Normal print Double-width print Compressed print Emphasized print Double-strike print All characters print This subtest prints the various print types shown below: Subtest 03 Wraparound NOTE: To execute this subtest, a printer wraparound connector must be connected to the...
3 Tests and Diagnostics 3.12 Async Test 3.12 Async Test To execute the Async Test, select 7 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions displayed on the screen. Move the highlight bar to the subtest you want to execute and press Enter.
3.13 Hard Disk Test 3 Tests and Diagnostics 3.13 Hard Disk Test To execute the Hard Disk Test, select 8 from the DIAGNOSTIC TEST MENU, press Enter, and follow the directions on the screen. CAUTION: The contents of the hard disk will be erased when subtest 02, 03, 04, 06, 08,or 09 is executed.
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3 Tests and Diagnostics 3.13 Hard Disk Test 4. The Hard Disk Test message will appear after you respond to the Detail Status prompt. Select the number of the subtest you want to execute and press Enter. The following message will appear during each subtest. XXX DIAGNOSTIC TEST VX.XX HARD DISK TEST XXXXXXX [Ctrl]+[Break] :...
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3.13 Hard Disk Test 3 Tests and Diagnostics Subtest 04 Cross talk & peak shift This subtest writes eight types of worst pattern data (listed below) to a cylinder, then reads the data while moving from cylinder to cylinder. (Test the data interference in the neighbor track) Worst pattern data Cylinder...
3 Tests and Diagnostics 3.14 Real Timer Test 3.14 Real Timer Test To execute the Real Timer Test, select 9 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter.
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3.14 Real Timer Test 3 Tests and Diagnostics Subtest 03 Real time carry CAUTION: When this subtest is executed, the current date and time are erased. This subtest checks the real time clock increments, making sure the date and time are displayed in the following format: Current date : 12-31-1999 Current time : 23:59:58 The real time increments are automatically executed and the following is...
3 Tests and Diagnostics 3.15 NDP Test 3.15 NDP Test To execute the NDP test, select 10 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. Subtest 01 This test checks the following functions of NDP: Control word Status word Addition...
3.16 Expansion Test 3 Tests and Diagnostics 3.16 Expansion Test To execute the expansion test, select 11 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. Subtest 01 PCMCIA wraparound NOTE: To execute this subtest, the PC card wraparound connector is required. This subtest checks the following signal line of the PC card slot: Address line REG#, CE#1, CE#2 line...
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3 Tests and Diagnostics 3.16 Expansion Test Subtest 02 RGB monitor ID NOTE: To execute this subtest, RGB monitor ID wraparound connector is required. The wiring diagram of the connector is described in Appendix F. Connect a wraparound connector to CRT monitor for the test of ID acquisition. This subtest is executed by using VESA command.
To execute the CD-ROM/DVD-ROM test, select 13 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. NOTE: For the subtest 01, 02 and 03, use the TOSHIBA CD-ROM TEST DISK TDY-01 or ABEX TEST CD-ROM TCDR-702 and DVD-ROM TEST DISK TSD-1. For the subtest 04, use a CD-RW on the market.
3 Tests and Diagnostics 3.18 Error Code and Error Status Names 3.18 Error Code and Error Status Names Table 3-2 lists the error codes and error status names for the Diagnostic Test. Table 3-2 Error codes and error status names (1/3) Device name Error code Error status name...
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3.18 Error Code and Error Status Names 3 Tests and Diagnostics Table 3-2 Error codes and error status names (2/3) Device name Error code Error status name FDD - BAD COMMAND ERROR FDD - ADDRESS MARK NOT FOUND FDD - WRITE PROTECTED FDD - RECORD NOT FOUND FDD - DMA OVERRUN ERROR FDD - DMA BOUNDARY ERROR...
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3 Tests and Diagnostics 3.18 Error Code and Error Status Names Table 3-2 Error codes and error status names (3/3) Device name Error code Error status name (HDD) HDD - WRITE FAULT HDD - STATUS ERROR HDD - BAD SECTOR HDD - ACCESS TIME ERROR HDD - NO HDD HDD - DMA CRC ERROR...
3.19 Hard Disk Test Detail Status 3 Tests and Diagnostics 3.19 Hard Disk Test Detail Status When an error occurs in the hard disk test, the following message is displayed: HDC status = XXXXXXXX Detailed information about the hard disk test error is displayed on the screen by an eight-digit number.
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3 Tests and Diagnostics 3.19 Hard Disk Test Detail Status Tables 3-4 Error register contents Name Description “0” … Not used (Bad block mark) “1” … A bad block mark is detected. “0” … There is no uncorrectable data error. (Uncorrectable) “1”...
3.20 ONLY ONE TEST 3 Tests and Diagnostics 3.20 ONLY ONE TEST 3.20.1 Program Description This program tests the unique functions of this model. 3.20.2 Operations Select test 2 from the DIAGNOSTIC MENU and press Enter. The following menu appears in the display.
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3 Tests and Diagnostics 3.20 ONLY ONE TEST Subtest 01 Pressed key display When you execute this subtest, the keyboard layout is drawn on the display as shown below. When any key is pressed, the corresponding key on the screen changes to the key character that was pressed.
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3.20 ONLY ONE TEST 3 Tests and Diagnostics Subtest 02 Touch Pad This subtest checks the functions of the touch pad as shown below. A) Direction and parameter B) Switching function check. This test displays the response from the touch pad and touch pad switch. When moving your finger on the touch pad towards the upper left, the <POINTING>...
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3 Tests and Diagnostics 3.20 ONLY ONE TEST Subtest 03 GP Button This subtest checks if the GP buttons work properly. The following message appears in the display. Press [Console] Button! Press the indicated button, then following message will appear in the display. Press [Console] Button! As the same way, press the indicated buttons and run the button test.
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3.20 ONLY ONE TEST 3 Tests and Diagnostics Subtest 05 NOTE: When executing this subtest, USB test module and USB cable must be connected. This subtest checks if USB port works properly. The following menu appears in the display. ################################################################# ######## ONLY ONE TEST Menu (XXXXXXXXX) #######...
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3 Tests and Diagnostics 3.20 ONLY ONE TEST Subtest 07 This subtest checks if each LED lights properly. The following message appears in the display in order. Follow the instructions in the display to execute the test. [HDD Access LED test] Confirm the LED of HDD status blinks properly.
3.21 Head Cleaning 3 Tests and Diagnostics 3.21 Head Cleaning 3.21.1 Function Description This function cleans the heads in the FDD by executing a series of head load/seek and read operations. A cleaning kit is necessary to perform this program. 3.21.2 Operations 1.
3 Tests and Diagnostics 3.22 Log Utilities 3.22 Log Utilities 3.22.1 Function Description This function logs error information generated while a test is in progress and stores the results in RAM. This function can store data on a floppy disk or output the data to a printer. The error information is displayed in the following order: 1.
3.22 Log Utilities 3 Tests and Diagnostics 3.22.2 Operations 1. Select 5 and press Enter in the DIAGNOSTIC MENU, logs error information into RAM or onto a floppy disk. The error information is displayed in the following format: XXXXX ERRORS TS-NO PASS STS ADDR...
3 Tests and Diagnostics 3.23 Running Test 3.23 Running Test 3.23.1 Function Description This function automatically executes the following tests in sequence: 1. System test (subtest 01) 2. Memory test (subtests 01, 02, 06) 3. Display test (subtest 01) 4. Real timer test (subtest 02) 5.
1. FORMAT NOTE: This program is only for testing a floppy disk drive. The option is different from the Toshiba MS-DOS FORMAT command. This program can format a floppy disk in the following formats: (a) 2DD: Double-sided, double-density, double-track, 96/135 TPI, MFM mode, 512 bytes, 9 sectors/track.
3 Tests and Diagnostics 3.24 Floppy Disk Drive Utilities 3.24.2 Operations 1. Selecting 7 from the DIAGNOSTIC MENU and pressing Enter displays the following message: [ FDD UTILITIES ] 1 - FORMAT 2 - COPY 3 - DUMP 4 – HDD-ID READ 9 - EXIT TO DIAGNOSTICS MENU 2.
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3.24 Floppy Disk Drive Utilities 3 Tests and Diagnostics 3. COPY program (a) When COPY is selected, the following message appears: FLOPPY DISK FORMAT & COPY : VX.XX Type select (0:2DD,3:2HD) ? (b) Selecting a media/drive type number will display a message similar to the one below: Insert source disk into drive A: Press any key when ready.
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3 Tests and Diagnostics 3.24 Floppy Disk Drive Utilities 4. DUMP program (a) When DUMP is selected, the following message appears: DIAGNOSTICS-HARD DISK & FLOPPY DISK DUMP : VX.XX Drive type select (1:FDD, 2:HDD) ? (b) Select a drive type. If is selected, the display will go to step (h).
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3.24 Floppy Disk Drive Utilities 3 Tests and Diagnostics (k) The following message will appear. To finish the dump, select 3. Press number key (1:up,2:down,3:end) ? (l) The following message will appear. Selecting 2 returns to the FDD UTILITIES MENU. Another dump (1:Yes,2:No) ? 5.
3 Tests and Diagnostics 3.25 System Configuration 3.25 System Configuration 3.25.1 Function Description The System Configuration program contains the following configuration information for the computer: 1. Processor Type [Code/L2 cache] 2. Chip set [VRAM] 3. BIOS ROM version [1st ID, 2nd ID] 4.
3.25 System Configuration 3 Tests and Diagnostics 3.25.2 Operations Select 8 from the DIAGNOSTIC MENU and press Enter. Then, the following system configuration appears in the display. System Configuration Display: Ver X.XX [Machine Name???] - Processor Type = XXXXXX-XXXXXMHz Code = XX L2 Cache = XXXXXKB - Chip set = XXXXXX...
3 Tests and Diagnostics 3.26 Wireless LAN Test Program (Intel-made b/g) 3.26 Wireless LAN Test Program (Intel-made b/g) This section describes how to perform the wireless LAN transmitting-receiving test (Intel- made Calexico 802.11b/g). To execute the wireless LAN test, use the Diagnostics disk for wireless LAN test.
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3.26 Wireless LAN Test Program (Intel-made b/g) 3 Tests and Diagnostics When a defective is detected in the test, following typical cause is considered. • Connection of wireless LAN card • Using a wrong wireless LAN card (Using unspecified card) •...
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3 Tests and Diagnostics 3.26 Wireless LAN Test Program (Intel-made b/g) Subtest03 Antenna check & communication test of 11b mode Caution: To execute subtest 03-05, use another computer (with Calexico wireless LAN card) that can communicate by the wireless LAN as a responder machine to perform those tests.
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3.26 Wireless LAN Test Program (Intel-made b/g) 3 Tests and Diagnostics Subtest04 Communication test of 11g mode This subtest checks the communication of wireless LAN antenna of Calexico 802.11g mode. After finishing the test, OK message will appear in the display. Press any key and return to the test menu.
3 Tests and Diagnostics 3.27 Wireless LAN Test Program (Intel-made a/b/g) 3.27 Wireless LAN Test Program (Intel-made a/b/g) This section describes how to perform the wireless LAN transmitting-receiving test (Intel- made Calexico 802.11a/b/g). To execute the wireless LAN test, use the Diagnostics disk for wireless LAN test.
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3.27 Wireless LAN Test Program (Intel-made a/b/g) 3 Tests and Diagnostics If a defective is found during the test, NG message will appear in the display. Press any key and following message will appear in the display. ************************************************************* SKU NG !! Other Card or Module not found ************************************************************* Press any key and return to the test menu.
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3 Tests and Diagnostics 3.27 Wireless LAN Test Program (Intel-made a/b/g) When a defective is detected in the test, following typical cause is considered. • Connection of wireless LAN card • Defective wireless LAN card • Disappearance of MAC address data Checking the connection, execute the subtest again.
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3.27 Wireless LAN Test Program (Intel-made a/b/g) 3 Tests and Diagnostics When a defective is detected in the test, following typical cause is considered. • Connection of wireless LAN card • Connection of wireless LAN antenna cable (Main/Aux) • Condition of wireless LAN communication (Interference/obstruction) •...
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3 Tests and Diagnostics 3.27 Wireless LAN Test Program (Intel-made a/b/g) Subtest05 Communication test of 11g mode This subtest checks the communication of wireless LAN antenna of Calexico 802.11g mode. For more details on procedure and contens of this subtest, refer to Subtest04 Communication test of 11a mode.
3.28 Wireless LAN Test Program (Askey-made) 3 Tests and Diagnostics 3.28 Wireless LAN Test Program (Askey-made) This section describes how to perform the wireless LAN transmitting-receiving test (Askey- made Atheros b/g, a/b/g). Caution: To execute subtest 03-07, use another computer (with Atheros wireless LAN card) that can communicate by the wireless LAN as a responder machine to perform those tests.
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3 Tests and Diagnostics 3.28 Wireless LAN Test Program (Askey-made) *********************************************************** Atheros MBxx(MBxxag/xxg) Maintenance T&D Menu 1 : SKU check of Module 2 : MAC Address Check 3 : Communication test of 11a mode(MBxxag) 4 : Communication test of 11b mode(MBxxag/MBxxg) 5 : Communication test of 11g mode(MBxxag/MBxxg) 6 : All the tests of MBxxg Module (SKU &...
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3.28 Wireless LAN Test Program (Askey-made) 3 Tests and Diagnostics Subtest02 MAC Address Check This subtest displays the MAC address. Selecting this subtest, following message will appear in the display. ************************************************************* MAC Address Check : OK !! ************************************************************* Press any key and return to the test menu. When a defective is detected in the test, following typical cause is considered.
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3 Tests and Diagnostics 3.28 Wireless LAN Test Program (Askey-made) When a defective is detected in the test, following typical cause is considered. • Connection of wireless LAN card • Connection of wireless LAN antenna cable (Main/Aux) • Condition of wireless LAN communication (Interference/obstruction) •...
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program This section describes how to perform the LAN/Modem/Bluetooth/IEEE1394 test with the test program. Insert the test program disk for LAN/Modem/Bluetooth/IEEE1394 test in FDD and turn on the power. The following message will appear: Microsoft Windows XX Startup Menu ---------------------------------- Modem...
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3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program Subtest01 (i82562 + ICHx) This subtest checks the operation of mini-PCI I/F by the loopback test in the chip. The following message will appear: [LAN transmit & receive test !] COMPLETED Repeat count = 00000 Error count 00000...
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3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics Subtest02 (GbE) CAUTION: Gigabit Ethernet test is not supported for this model. This subtest checks the operation of mini-PCI I/F by the loopback test in the chip. Select 2 to execute and press Enter. The following message will appear: Testing adaptor...hit <ESC>...
3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3.29.2 Modem test For this subtest, connect the modem PCB and RJ11 connector with a harness. Use the dedicated “FAT-MODE inspection device (product code: QE2000P01 made by Nitto Denki Seisakusyo)” for the tests. To execute Modem test, press 2 and Enter.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics 3.29.3 Bluetooth test CAUTION: Bluetooth test is not supported for this model. To execute this test, input 3 and press Enter. Note: Use another computer that can communicate by the Bluetooth as a reference machine to perform this test.
1 to select the test and press Enter. The following message will appear: ----------------------------------------------------------------------------- Bluetooth Subsystem T&D for PCSE(BD_ADDR) VerX.XX Copyright (C) by TOSHIBA Co. ----------------------------------------------------------------------------- Initializing … When the machine has passed the test, it displays BD_ADDR. If BD_ADDR has no problem, the following message is displayed.
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3 Tests and Diagnostics If the target machine has any problem, it displays Error CODE. The following message is displayed. ----------------------------------------------------------------------------- Bluetooth Subsystem T&D for PCSE(BD_ADDR) VerX.XX Copyright (C) by TOSHIBA Co. ----------------------------------------------------------------------------- My BD_ADDR = XXXXXXXXXXXX [h] FFFFFF FFFFFF...
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3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program If the machine detects a malfunction, it indicates the error code as shown below. The error code begins with the least significant digit. Error code Table 3-6 Error code for Bluetooth test (BD_ADDR) (1/2) Error code Meaning 0x01...
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When the test begins, the machine displays BD_ADDR of the DUT. The progress bar stops when the test is completed. The following message is displayed. ----------------------------------------------------------------------------- Bluetooth Subsystem T&D for PCSE(CS-Air) VerX.XX Copyright (C) by TOSHIBA Co. ----------------------------------------------------------------------------- +----------------------+ BD_ADDR of the DUT = XXXXXXXXXXXXX [h] +----------------------+ <- Progress Bar...
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When the Bluetooth test menu is displayed, press T to select the test and press Enter in the test machine. The following message will appear: ----------------------------------------------------------------------------- Bluetooth Subsystem T&D for PCSE(CS-Air) VerX.XX Copyright (C) by TOSHIBA Co. ----------------------------------------------------------------------------- +------------------+ Tester...
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3 Tests and Diagnostics If the target machine has any problem, the following message “INCOMPLETE” is displayed with the Error Code. ----------------------------------------------------------------------------- Bluetooth Subsystem T&D for PCSE(CS-Air) VerX.XX Copyright (C) by TOSHIBA Co. ----------------------------------------------------------------------------- +----------------------+ BD_ADDR of the DUT = XXXXXXXXXXXXX [h] +----------------------+...
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3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program If the machine detects a malfunction, it indicates the error code as shown below. The error code begins with the least significant digit. Error code Table 3-7 Error code for Bluetooth test (BD_ADDR of the DUT) (1/2) Error code Meaning 0x01...
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3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics Table 3-7 Error code for Bluetooth test (BD_ADDR of the DUT) (2/2) Error code Meaning 0x20 Unsupported LMP Parameter Value. 0x21 Role Change Not Allowed. 0x22 LMP Response Timeout. 0x23 LMP Error Transaction Collision. 0x24 LMP PDU Not Allowed.
3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3.29.4 IEEE1394 test To execute this test, input 4 and press Enter. NOTE: Use another computer that can communicate by IEEE1394 (i. Link) cable as a reference machine to perform this test. The following menu will appear: ******************************************************************** ********...
3.30 Sound Test program 3 Tests and Diagnostics Tests and Dia gnos tics 3.30 Sound Test program This section describes how to perform the Sound test. To execute the sound test, refer to the following description. Insert the test program disk for Sound test in the floppy disk drive and turn on the power. The following message will appear: ################################################################ ######...
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3 Tests and Diagnostics 3.30 Sound Test program To return to the Sound test menu, Press 9 and Enter. Then following message will appear in the display. *********************************** ******** May I Restart ? ******* *********************************** Press any key to continue… After pressing any key, the machine starts rebooting and sound test menu will appear in the display.
3.30 Sound Test program 3 Tests and Diagnostics Subtest02 Sine Wave This subtest is executed by loading the COM file (ADSIN.COM). The program expands sine wave data table from 16KB to 64KB, and creates the play data. Then it transfers the data between the DMA and the CODEC to play the sine wave.
To execute the CD Sound (Standard) test, press 3 and Enter. Insert the test media (TOSHIBA TEST CD-ROM or ABEX TEST CD-ROM) or music CD on the market (if the test media can not be prepared). Following menu appears in the display.
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3.30 Sound Test program 3 Tests and Diagnostics Subtest02 English Narration Selected this subtest, narration in English starts. For more details on the procedure, refer to the subtest01. Subtest03 Test Tone A Caution: Before starting subtest03, be sure to set the sound at proper volume. This subtest plays sine wave while changing its table from 100Hz to 20Hz.
3 Tests and Diagnostics 3.30 Sound Test program (2) Audio CD Insert an audio CD and the following menu appears in the display. CD/DVD TEST IN PROGRESS XXXXXXXX xxxxxxx DIAGNOSTIC TEST VX.XX [Ctrl]+[Break] ; test end [Ctrl]+[C] ; key stop SUB-TEST : XX PASS COUNT : XXXXX...
3.31 SETUP 3 Tests and Diagnostics 3.31 SETUP 3.31.1 Function Description This program displays the current system setup information as listed below: 1. Memory 2. System Date/Time 3. Battery (a) Battery Save Mode (b) PCI Express Link ASPM 4. Password 5.
3.31 SETUP 3 Tests and Diagnostics 3.31.2 Accessing the SETUP Program Selecting 0 from the DIAGNOSTICS MENU and pressing Enter displays the followings: 3-92 [CONFIDENTIAL] Satellite A50S/TECRA A3X Maintenance Manual (960-534)
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3 Tests and Diagnostics 3.31 SETUP NOTE: *1. HDD PASSWORD window shows slightly different display for each model. *2. LCD Display Streatch is displayed only for the model with XGA panel. *3. Dynamic CPU Frequency Mode is displayed only for the model with Pentium-M processor.
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3.31 SETUP 3 Tests and Diagnostics Moving Within the SETUP Menu and Changing Values to move between the two columns. Press ↑ and ↓ to move between 1. Press items in a column. Press Fn+↑ (PgUp) and Fn + ↓ (PgDn) to move between the two pages.
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3 Tests and Diagnostics 3.31 SETUP SETUP Options The SETUP screen is divided into 14 functionally related groups. This section describes each group and its options. 1. Memory This group of options displays the computer’s memory. This field displays the total amount of memory installed and is automatically calculated by the computer.
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3.31 SETUP 3 Tests and Diagnostics NOTE: Display of the LCD Brightness will be changed in the condition below: (*1) Operating the battery (*2) Using the AC adapter User Setting Use this option to set the battery save parameters on the sub-window, BATTERY SAVE OPTIONS.
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3 Tests and Diagnostics 3.31 SETUP Battery optimized If the CPU becomes too hot, the processing speed is lowered. If the temperature is still too high, the fan turns on. When the CPU temperature falls to a normal range, the fan is turned off and the processing speed is increased.
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3.31 SETUP 3 Tests and Diagnostics 5. HDD Password This option registers, resets or changes the HDD password. (a) HDD Hard disk for setting the password. Built-in HDD The password is set to Built-in HDD. (This cannot be changed.) (b) HDD Password Mode This item registers HDD password and can be selected only for registering HDD password.
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3 Tests and Diagnostics 3.31 SETUP CD-ROM→LAN→FDD→HDD: The computer looks for bootable files in the following order: CD-ROM, LAN, FDD and HDD. HDD→FDD→CD-ROM→LAN: The computer looks for bootable files in the following order: HDD, FDD, CD- ROM and LAN. (Default) (*1) CD-ROM refers to a Optical Disk Drive.
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3.31 SETUP 3 Tests and Diagnostics LCD Display Stretch enables or disables a larger display area of the screen. Enabled Enables the LCD display stretch feature. (Default) Disabled Disables the LCD display stretch feature. (c) TV Type This option allows you to select the type of TV. NTSC (Japan) TV in Japanese system NTSC (US)
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3 Tests and Diagnostics 3.31 SETUP Available Enable the Execute-Disable Bit function. Not Available Disable the Execute-Disable Bit function. (c) Auto Power On This option displays setting for Auto Power On. Disabled Indicates auto power on is not set. Enabled Indicates auto power on is set.
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3.31 SETUP 3 Tests and Diagnostics This option selects the language during bootup. This message appears only on the model for TCL (Canada). English Message is displayed in English. (Default) French Message is displayed in French. 9. Configuration This option lets you set the device configuration. All Devices BIOS sets all devices.
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3 Tests and Diagnostics 3.31 SETUP 10. I/O ports This option controls settings for the serial and parallel ports. (a) Serial Use this option to set the COM level for the serial port. The serial port interrupt request level (IRQ) and I/O port base address for each COM level is shown below: COM level Interrupt level...
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3.31 SETUP 3 Tests and Diagnostics When you select one of the above options, except for Not Used, a subwindow similar to the one below appears to let you set the DMA. The options for this setting are Channel 1and Channel 3 (Default). OPTIONS = Channel 3 (Default) For most printers, the port should be set to ECP.
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3 Tests and Diagnostics 3.31 SETUP 14. Peripheral Use this option to select the peripheral's mode. (a) Internal Pointing Device This option enables or disables the touch pad Enabled Enables the touch pad. (Default) Disabled Disables the touch pad. (b) Ext Keyboard "Fn" This option enables or disables Fn key function on the external keyboard.
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3.31 SETUP 3 Tests and Diagnostics NOTE: When using Windows, the setting of “Toshiba HW setup” is enabled and the setting of “Parallel Port Mode” is disabled. 15. LEGACY EMULATION (a) USB KB/Mouse Legacy Emulation This option sets the Legacy support condition of the USB keyboard and the USB mouse.
4.1 Overview 4 Replacement Procedures Overview This chapter describes the procedure for removing and replacing the field replaceable units (FRUs) in the PC. It may not be necessary to remove all the FRUs in order to replace one. The chart below provides a guide as to which other FRUs must be removed before a particular FRU can be removed.
Danger: 1. In the case of the battery, always use authentic parts or equivalent parts approved by Toshiba. Other batteries may have different specifications that are incompatible with the computer and may result in fire or explosion.
4.1 Overview 4 Replacement Procedures Before You Begin Take note of the following points before starting work. Always remove the AC adapter and battery pack before commencing any of the procedures. The procedure for removing the battery pack is described in section “4.2.1 Battery Pack”. 1.
4 Replacement Procedures 4.1 Overview Disassembly Procedures Three main types of cable connector are used. Pressure plate connector Spring connector Normal pin connector When disconnecting a pressure plate connector, lift up the tag on one side of the plastic pressure plate on the connector and pull the cable out from the connector. When reconnecting a cable to a pressure plate connector, lift up the pressure plate to a suitable height and insert the cable into the connector.
4.1 Overview 4 Replacement Procedures Assembly Procedure After the computer has been disassembled and the part that caused the fault has been repaired or replaced, the computer must be reassembled. Take note of the following general points when assembling the computer. Take your time and follow the instructions carefully.
4 Replacement Procedures 4.1 Overview Screw Tightening Torque Use the following torque when tightening screws. CAUTION: Overtightening may damage screws or parts. Undertightening may allow screws to loosen (and possibly fall out) causing a short circuit or other damage. NOTE: To tighten screws quickly and accurately, an electric screwdriver is recommended.
4.1 Overview 4 Replacement Procedures Screw Notation To make maintenance of the computer easier, markings of the kinds of the screws including the types and lengths of the screws are indicated on the computer body. Format: Screw shape + Screw length (mm) Screw shape B: Bind screw F: Thin head screw...
4 Replacement Procedures 4.2 Battery Pack/PC Card Battery Pack/PC Card 4.2.1 Battery Pack Removing the battery pack The following describes the procedure for removing the battery pack (See Figure 4-1). CAUTION: Take care not to short circuit the terminals when removing the battery pack. Similarly, do not drop, knock, scratch, disassemble, twist, or bend the battery pack.
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There is a danger that the lithium ion battery pack may explode if not fitted, operated, handled, or disposed correctly. Collect the spent battery packs. Use only the batteries approved by Toshiba. NOTE: Check visually the battery terminals and clean off any dirt with a dry cloth.
4 Replacement Procedures 4.2 Battery Pack/PC Card 4.2.2 PC Card Removing the PC card The following describes the procedure for removing a PC card (See Figure 4-2). CAUTION: Insert or remove the PC card in accordance with any instructions in the PC card manual or the manuals of the computer system you are using.
4.3 Memory Module 4 Replacement Procedures Memory Module CAUTION:The power of the computer must be turned off when you remove the memory module. Removing a memory module with the power on risks damaging the module or the computer itself. Do not touch the memory module terminals. Any dirt on the terminals may cause memory access problems.
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4 Replacement Procedures 4.3 Memory Module 4. Open the left and right latches and remove the memory module. SLOT A: Standard Memory Memory Module Latch Latch SLOT B: Expansion Memory Figure 4-4 Removing Memory Module 4-12 [CONFIDENTIAL] Satellite A50S/TECRA A3X Maintenance Manual (960-534)
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4.3 Memory Module 4 Replacement Procedures Installing the memory module Before installing the memory module, confirm that the computer is not in stanby mode or hibernation mode. Then perform the following procedure (See Figure 4-3, 4-4). 1. Insert the memory module into the connector of the computer slantwise (terminal side first) and press it to connect firmly.
4 Replacement Procedures 4.4 MDC Removing the MDC The following describes the procedure for removing an MDC (See Figure 4-5). CAUTION:Since the MDC slot cover is easily broken, remove the memory cover first before removing the MDC slot cover. When replacing the MDC, The power must be turned off when you remove the MDC.
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4.4 MDC 4 Replacement Procedures Installing the MDC The following describes the procedure for installing an MDC(See Figure 4-5). 1. Connect the MDC cable to the connector JP1 on the MDC. 2. Set the MDC on the slot and connect the MDC to the connector CN3020 on the system board by pressing it from the top.
4 Replacement Procedures 4.5 HDD Removing the HDD The following describes the procedure for removing an HDD (See Figure 4-6 to 4-8). CAUTION: Take care not to press on the top or bottom of the HDD. Pressure may cause data loss or damage to the device. 1.
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4.5 HDD 4 Replacement Procedures 3. Holding the tab, pull horizontally the HDD ASSY to disconnect it from the connector and remove it. HDD ASSY Figure 4-7 Removing HDD ASSY 4. Remove the following screws fixing the HDD. • M3x4S THIN BIND screw 5.
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4 Replacement Procedures 4.5 HDD Installing the HDD The following describes the procedure for installing an HDD (See Figure 4-6 to 4-8). 1. Install the HDD holder to the HDD with the following screws. • M3x4S THIN BIND screw 2. Put the HDD ASSY into the HDD slot and connect it to the connector CN1800 on the system board.
4.6 Wireless LAN card 4 Replacement Procedures Wireless LAN card CAUTION: The power must be turned off when you remove a wireless LAN card. Removing a wireless LAN card with the power on risks damaging the card or the computer itself. Never press hard or bend the wireless LAN card.
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4 Replacement Procedures 4.6 Wireless LAN card 3. Disconnect two wireless LAN cables from connectors on the wireless LAN card. 4. Peel off one glass tape and two insulators remove the cables from the guide. 5. Open the left and right latches holding the wireless LAN card and remove the wireless LAN card.
4.7 Cooling Fin/CPU 4 Replacement Procedures Cooling Fin/CPU Removing the Cooling fin/CPU The following describes the procedure for removing the cooling fin/CPU (See Figure 4-11 to 4-14). 1. Remove the following screws fixing the CPU cover and remove the CPU cover. •...
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4 Replacement Procedures 4.7 Cooling Fin/CPU 2. Remove the following screws securing the CPU holder on the CPU. • M2x4B BIND screw M2x4B BIND CPU Holder Figure 4-12 Removing CPU Holder 4-22 [CONFIDENTIAL] Satellite A50S/TECRA A3X Maintenance Manual (960-534)
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4.7 Cooling Fin/CPU 4 Replacement Procedures 3. Lift up the cooling fin and remove it. Cooling Fin Figure 4-13 Removing Cooling Fin 4. Unlock the CPU by rotating counterclockwise the cam on the CPU socket by 90 degrees with a flat-blade screwdriver (in the order shown in the figure below). 5.
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4 Replacement Procedures 4.7 Cooling Fin/CPU Installing the Cooling fin/CPU The following describes the procedure for installing the cooling fin/CPU (See Figure 4-11 to 4-16). 1. Check that the mark on the cam is in the unlocking position. 2. Attach the CPU to the correct position in the CPU socket. CAUTION: Place the CPU in such direction as shown below.
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4.7 Cooling Fin/CPU 4 Replacement Procedures NOTE: Apply the silicon grease enough to cover the chip surface using the special applicator. When installing the cooling fin, make sure the bottom of the fin covers the top of CPU. CPU Chip Figure 4-16 Applying Silicon Grease 5.
4 Replacement Procedures 4.8 Keyboard Keyboard Removing the Keyboard The following describes the procedure for removing the keyboard (See Figure 4-17 to 4-19). CAUTION:As the keytop may fall out, when handling the keyboard always hold it by the frame and do not touch the keytop. 1.
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4.8 Keyboard 4 Replacement Procedures 3. Remove the following screws holding the keyboard. • M2.5×2.8B THIN BIND screw 4. Remove the following screw fixing the keyboard hold plate and remove the keyboard hold plate by pulling it to the right side. •...
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4 Replacement Procedures 4.8 Keyboard 6. Remove the following screw fixing the keyboard support plate underneath the keyboard. • M2.5x8B THIN BIND screw 7. Remove the keyboard support plate. M2.5x8B THIN BIND Keyboard support plate Keyboard Flexible Cable Glass tape CN3200 Keyboard Figure 4-19 Removing Keyboard support plate...
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4.8 Keyboard 4 Replacement Procedures Installing the Keyboard The following describes the procedure for installing the keyboard (See Figure 4-17 to 4-19). 1. Place the keyboard on the palm rest as its face is down. Connect the keyboard flexible cable to the connector CN3200 on the system board. 2.
4 Replacement Procedures 4.9 Switch membrane board Switch membrane board Removing the Switch membrane board The following describes the procedure for removing the switch membrane board (See Figure 4-20). 1. Open the display and unlock the connector. Disconnect the switch membrane board cable from the connector CN3280 on the system board.
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4.9 Switch membrane board 4 Replacement Procedures Installing the Switch membrane board The following describes the procedure for installing the switch membrane board (See Figure 4-20). 1. Place the switch membrane board to the left side of the installation position and slide it to the right to install.
4 Replacement Procedures 4.10 Optical Drive 4.10 Optical Drive NOTE: Do not apply excessive force to the top of an optical drive. Removing the Optical drive The following describes the procedure for removing the optical drive (See Figure 4-21, 4-22). 1.
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4.10 Optical Drive 4 Replacement Procedures 3. Remove the following screws fixing the rear bracket from the optical drive assembly. • M2x2.7 STEP screw 4. Remove the following screw fixing the side bracket and remove the side bracket. • M2x3S SUPER THIN BIND screw optical drive assembly Side Bracket...
4 Replacement Procedures 4.11 Display Assembly 4.11 Display Assembly Removing the Display assembly The following describes the procedure for removing the display assembly (See Figure 4-23 to 4-25). 1. Close the display and turn the computer face down. 2. Remove the following screws from the bottom of the computer. •...
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4.11 Display Assembly 4 Replacement Procedures 3. Turn the computer face up. Open the display and disconnect the speaker cables (Blue, Red) from the connectors on the system board. Unlock the connector and disconnect the touch pad cable from the system board. 4.
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4 Replacement Procedures 4.11 Display Assembly 6. Pull out the wireless LAN antenna cables from the slot near the center of the base assembly. NOTE: When removing the display assembly, be careful not to cut or scratch the wireless LAN antenna cables. 7.
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4.11 Display Assembly 4 Replacement Procedures Installing the Display assembly The following describes the procedure for installing the display assembly (See Figure 4-23 to 4-25). 1. Pass the wireless LAN antenna cables through the slot near the center of the base assembly.
4 Replacement Procedures 4.12 Sound Board 4.12 Sound Board Removing the Sound Board The following describes the procedure for removing the sound board (See Figure 4-26). 1. Unlock the connector and disconnect the sound board cable from the connector of CN9510 on the sound board.
4.13 Parallel port board / Serial port board / S-Video board 4 Replacement Procedures 4.13 Parallel port board / Serial port board / S-Video board Depending on the model, the machine has a different type board (Parallel port board / Serial port board / S-Video board).
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4 Replacement Procedures 4.13 Parallel port board / Serial port board / S-Video board 3. Disconnect the USB harness from the connector CN4620 and the parallel port cable from the connector CN3503 on the parallel port board. 4. Remove the parallel port board by lifting it. CN4620 Parallel port board CN3503...
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4.13 Parallel port board / Serial port board / S-Video board 4 Replacement Procedures Installing the Parallel port board The following describes the procedure for installing the Parallel port board (See Figure 4-27, 4-28). 1. Install the parallel port board on the base assembly. 2.
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4 Replacement Procedures 4.13 Parallel port board / Serial port board / S-Video board 4.13.2 Serial port board Removing the serial port board The following describes the procedure for removing the serial port board (See Figure 4-27, 4- 29). NOTE: The procedure 1 and 2 are the same items as parallel port board. Refer to the figure 4-27 in the parallel port board.
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4.13 Parallel port board / Serial port board / S-Video board 4 Replacement Procedures Installing the Serial port board The following describes the procedure for installing the Serial port board (See Figure 4-27, 4-29). 1. Install the serial port board on the base assembly. 2.
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4 Replacement Procedures 4.13 Parallel port board / Serial port board / S-Video board 4.13.3 S-Video board Removing the S-Video board The following describes the procedure for removing the S-Video board (See Figure 4-27, 4- 30). NOTE: The procedure 1 and 2 are the same items as parallel port board. Refer to the figure 4-27 in the parallel port board.
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4.13 Parallel port board / Serial port board / S-Video board 4 Replacement Procedures Installing the S-Video board The following describes the procedure for installing the S-Video board (See Figure 4-27, 4- 30). 1. Install the serial port board on the base assembly. 2.
4 Replacement Procedures 4.14 Fan 4.14 Fan Removing the Fan The following describes the procedure for removing the fan (See Figure 4-31). 1. Disconnect the fan cable from the connector CN8770 on the system board. 2. Remove the following screws and remove the fan by raising it up. •...
4.15 System Board/DC-IN Jack/RTC Battery 4 Replacement Procedures 4.15 System Board/DC-IN Jack/RTC Battery CAUTION: When handling the system board, always hold by the edges. Do not touch the printed circuit face. After replacing the system board with a new one, update the DMI information as described Chapter 3.
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4 Replacement Procedures 4.15 System Board/DC-IN Jack/RTC Battery 3. Remove the LAN harness and Modem harness from the base assembly. 4. Remove the following screws securing the system board. • M2.5x4B THIN BIND screw 5. [Parallel port board model or Serial port board model] Disconnect the parallel port cable or serial port cable from the connector CN3502 on the system board.
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4.15 System Board/DC-IN Jack/RTC Battery 4 Replacement Procedures Installing the System board/DC-IN jack/RTC battery The following describes the procedure for installing the system board/DC-IN jack/RTC battery (See Figure 4-32, 4-33). 1. Connect the Modem harness to the connector CN3011 and the LAN harness to CN4100 on the back of the system board and secure them with glass tapes.
4 Replacement Procedures 4.16 PC card cover 4.16 PC card cover Removing the PC card cover The following describes the procedure for removing the PC card cover (See Figure 4-34). 1. Remove the following screws securing the PC card cover. •...
4.17 Battery Latch 4 Replacement Procedures 4.17 Battery Latch Removing the Battery latch The following describes the procedure for removing the battery latch (See Figure 4-35, 4-36). 1. While pressing projections of the SB latch button inside each other, push the SB latch button to the bottom of the base assembly to remove.
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4 Replacement Procedures 4.17 Battery Latch Installing the Battery latch The following describes the procedure for installing the battery latch (See Figure 4-35, 4-36). 1. Set the spring to the battery lock L and install it on the base assembly. 2.
4.18 Battery Lock 4 Replacement Procedures 4.18 Battery Lock Removing the Battery lock The following describes the procedure for removing the battery lock (See Figure 4-34, 4-35). 1. While pressing projections of the battery lock button inside each other, push the button to the bottom of the base assembly to remove.
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4 Replacement Procedures 4.18 Battery Lock Installing the Battery lock The following describes the procedure for installing the battery latch (See Figure 4-37, 4-38). 1. Set the spring to the battery lock R and install it on the base assembly. 2.
4.19 Touch Pad 4 Replacement Procedures 4.19 Touch Pad Removing the Touch pad The following describes the procedure for removing the touch pad (See Figure 4-36). 1. Remove the following screws securing the touch pad. • M2.5x4B THIN BIND screw 2.
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4 Replacement Procedures 4.19 Touch Pad Installing the Touch pad The following describes the procedure for installing the touch pad (See Figure 4-39). 1. Place the touch pad switch fitting to bosses. 2. Place the touch pad according to the guide pins. 3.
4.20 LCD Unit/FL Inverter 4 Replacement Procedures 4.20 LCD Unit/FL Inverter Removing the LCD unit/FL inverter The following describes the procedure for removing the LCD unit and FL inverter (See Figure 4-40 to 4-42). 1. Peel off two mask seals from the front of the display mask and remove the following screws.
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4 Replacement Procedures 4.20 LCD Unit/FL Inverter 3. Remove the following screw fixing the FL inverter. • M2x4Z SUPER THIN BIND screw x1 4. Peel off the insulators in the HV cable side and disconnect two cables from the FL inverter.
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4.20 LCD Unit/FL Inverter 4 Replacement Procedures 8. Remove the following screws securing the LCD brackets. Remove the LCD brackets from the LCD module. • M2x3 SUPER THIN BIND screw M2x3C SUPER THIN BIND LCD Bracket M2x3C SUPER THIN BIND Figure 4-42 Removing LCD Bracket Satellite A50S/TECRA A3X Maintenance Manual (960-534) [CONFIDENTIAL]...
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4 Replacement Procedures 4.20 LCD Unit/FL Inverter Installing the FL inverter/LCD unit The following describes the procedure for installing the LCD unit/FL inverter (See Figure 4- 40 to 4-42). 1. Secure the LCD brackets to the LCD module with the following screws. •...
4.21 Latch Assembly 4 Replacement Procedures 4.21 Latch Assembly Removing the Latch assembly The following describes the procedure for removing latch assembly (See Figure 4-43). 1. Press the latch assembly in the direction indicated by arrow to remove it from the display cover.
4 Replacement Procedures 4.22 Wireless LAN Antenna/Speaker/Hinge 4.22 Wireless LAN Antenna/Speaker/Hinge Removing the Wireless LAN antenna/Speaker/Hinge The following describes the procedure for removing the wireless LAN antenna, speaker and hinge (See Figure 4-44 to 4-52). 1. Peel off eight glass tapes securing the wireless LAN antenna cables (white and black).
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4.22 Wireless LAN Antenna/Speaker/Hinge 4 Replacement Procedures [Sharp-made LCD] Glass Tape Wireless LAN antenna cable Glass Tape Sponge Glass Tape Wireless LAN antenna Sponge [LG Philips-made LCD] Glass Tape Wireless LAN Glass Tape antenna cable Aluminum Tape Gasket Glass Tape Aluminum Tape Wireless LAN antenna Figure 4-44 Removing wireless LAN antennas...
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4 Replacement Procedures 4.22 Wireless LAN Antenna/Speaker/Hinge 2. Remove the following screw securing the LCD harness holder to remove it. • M2x4Z SUPER THIN screw M2x4Z SUPER THIN LCD harness Holder Insulator slot Figure 4-45 Removing LCD harness Holder 3. Remove the following screws securing the display cover to the hinges. •...
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4.22 Wireless LAN Antenna/Speaker/Hinge 4 Replacement Procedures 5. Remove the following screws securing the hinge caps and remove the hinge caps. • M2.5x6B THIN BIND screw 6. Remove the LCD harness. 7. Remove the wireless LAN antenna cables. M2.5x6B THIN BIND Hinge Cap Insulator M2.5x6B...
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4 Replacement Procedures 4.22 Wireless LAN Antenna/Speaker/Hinge 8. Remove the following screws securing the optical drive cover from the back of the display assembly. To remove the optical drive cover, pull it out to the right hinge first. • M2.5x2.8B U-THIN BIND screw x3 •...
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4.22 Wireless LAN Antenna/Speaker/Hinge 4 Replacement Procedures 9. Remove the following screws securing the hinges to the display assembly. • M2.5x4B THIN BIND screw x3 (Right:1, Left: 2) 10. Peel off the accetate tapes securing the speaker cables and take out the cable under the insulator.
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4 Replacement Procedures 4.22 Wireless LAN Antenna/Speaker/Hinge 11. Remove the following screws securing the speakers. • M2. 5x4B THIN BIND screw CAUTION: When removing the speakers, be careful not to touch the metal part of the speakers. It might damage the speakers. 12.
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4.22 Wireless LAN Antenna/Speaker/Hinge 4 Replacement Procedures Installing the Wireless LAN antenna/Speaker/Hinge The following describes the procedure for installing the wireless LAN antenna, speaker and hinge (See Figure 4-44 to 4-52). CAUTION: When installing the speakers, be careful not to touch the metal part of the speakers.
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4 Replacement Procedures 4.22 Wireless LAN Antenna/Speaker/Hinge 6. Install the optical drive cover and secure it with the following screws. When installing, insert the “A” portion (in the figure) first. • M2.5x2.8B U-THIN BIND screw x3 • M2.5x4B THIN BIND screw 7.
4.23 Fluorescent Lamp 4 Replacement Procedures 4.23 Fluorescent Lamp This system uses LCD modules from the following suppliers. The procedure for replacing the fluorescent lamp is different for each LCD module. Refer to the appropriate procedure. Type Part No. Supplier Section 15.0 inch G33C0002W110...
4 Replacement Procedures 4.23 Fluorescent Lamp 4.23.1 Replacing the 15.0 Inch XGA Samsung Fluorescent Lamp Disassembling the 15.0 Inch XGA Samsung Fluorescent Lamp To disassemble the 15.0 inch XGA Samsung fluorescent lamp, follow the steps below and refer to figures4-53 to 4-61. 1.
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4.23 Fluorescent Lamp 4 Replacement Procedures 2. Remove the two screws. Screw Screw Figure 4-54 Replacing 15.0 Inch Samsung fluorescent lamp (XGA) (2) 3. Remove the four screws from the top chassis. Screw Screw Screw Screw Figure 4-55 Replacing 15.0 Inch Samsung fluorescent lamp (XGA) (3) Satellite A50S/TECRA A3X Maintenance Manual (960-534) [CONFIDENTIAL] 4-73...
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4 Replacement Procedures 4.23 Fluorescent Lamp 4. Remove the four bottom hooks and four side hooks (left and right). Then remove the top chassis from the mold frame. Side hook Side hook Bottom hook Figure 4-56 Replacing 15.0 Inch Samsung fluorescent lamp (XGA) (4) 4-74 [CONFIDENTIAL] Satellite A50S/TECRA A3X Maintenance Manual (960-534)
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4.23 Fluorescent Lamp 4 Replacement Procedures 5. Remove the panel assembly from the mold frame. NOTE: When removing the panel assembly, be careful not to damage the COF. Panel assembly Mold frame Figure 4-57 Replacing 15.0 Inch Samsung fluorescent lamp (XGA) (5) Satellite A50S/TECRA A3X Maintenance Manual (960-534) [CONFIDENTIAL] 4-75...
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4 Replacement Procedures 4.23 Fluorescent Lamp 6. Remove the sheets and clips. 1) Remove the two clips fixing the sheets. 2) Remove the sheets (protection sheet, prism sheet (L, U), diffusion sheet, LGP and reflection sheet). Clip Clip Sheets Figure 4-58 Replacing 15.0 Inch Samsung fluorescent lamp (XGA) (6) 4-76 [CONFIDENTIAL] Satellite A50S/TECRA A3X Maintenance Manual (960-534)
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4.23 Fluorescent Lamp 4 Replacement Procedures 7. Remove the lamp back cover. 1) Remove the two screws from the lamp back cover. 2) Remove the lamp back cover. Screw Screw Lamp back cover Figure 4-59 Replacing 15.0 Inch Samsung fluorescent lamp (XGA) (7) Satellite A50S/TECRA A3X Maintenance Manual (960-534) [CONFIDENTIAL] 4-77...
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4 Replacement Procedures 4.23 Fluorescent Lamp 8. Remove the lamp wire from the wire guide of the mold frame. Lamp wire Figure 4-60 Replacing 15.0 Inch Samsung fluorescent lamp (XGA) (8) 4-78 [CONFIDENTIAL] Satellite A50S/TECRA A3X Maintenance Manual (960-534)
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4.23 Fluorescent Lamp 4 Replacement Procedures 9. Remove the lamp assembly from the mold frame. Lamp assembly Mold frame Figure 4-61 Replacing 15.0 Inch Samsung fluorescent lamp (XGA) (9) Satellite A50S/TECRA A3X Maintenance Manual (960-534) [CONFIDENTIAL] 4-79...
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4 Replacement Procedures 4.23 Fluorescent Lamp Assembling the 15.0-inch XGA Samsumg Fluorescent Lamp The assembly procedure of the 15.0-inch XGA Samsung fluorescent lamp is the reverse of the above disassembly procedure. 4-80 [CONFIDENTIAL] Satellite A50S/TECRA A3X Maintenance Manual (960-534)
4.23 Fluorescent Lamp 4 Replacement Procedures 4.23.2 Replacing the 15.0 Inch XGA Sharp Fluorescent lamp Disassembling the 15.0 Inch XGA Sharp Fluorescent lamp To disassemble the 15.0-inch XGA Sharp fluorescent lamp, follow the steps below and refer to Figures 4-62 to 4-71. 1.
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4 Replacement Procedures 4.23 Fluorescent Lamp 2. Remove the four screws on the sides. Screw loosening torque: 1.2kg•cm Screw Screw Screw Screw Figure 4-63 Replacing 15.0 Inch Sharp fluorescent lamp (XGA) (2) 3. Turn the LCD module face up and remove the bezel (E). (3) Release the hook of the bezel from the lamp cover.
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4.23 Fluorescent Lamp 4 Replacement Procedures 4. Turn the LCD module face down and remove the two screws fixing the board. Then open the bent portion of the TCP of the board and remove the backlight. Screw loosening torque: 1.2kg•cm Screw Screw Figure 4-65 Replacing 15.0 Inch Sharp fluorescent lamp (XGA) (4)
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4 Replacement Procedures 4.23 Fluorescent Lamp 5. Turn the LCD module face up and remove the LCD panel (I) from the backlight unit (H). CAUTION: Wear finger sacks or gloves during the work not to soil or scratch the LCD panel or backlight unit.
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4.23 Fluorescent Lamp 4 Replacement Procedures 6. Turn the backlight unit (H) removed face down and remove the two screws (D) and lamp cover (J). NOTE: Be careful not to scratch or soil the sheets. (H) Backlight unit Screw loosening torque: 1.2kg•cm (D) Screw (D) Screw (J) Lamp cover...
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4 Replacement Procedures 4.23 Fluorescent Lamp 7. Turn the backlight unit face up and remove the upper diffusion sheet (K), lens sheet (L) and light guide (M). NOTE: Be careful not to scratch or soil the removed sheets or light guide to reuse them. Do not remove the reflection sheet under the light guide.
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4 Replacement Procedures 4.23 Fluorescent Lamp 9. Turn the backlight unit face down and remove the lamp unit (R) from the P-chassis. CAUTION: When removing the lamp unit, be careful not to break the lamp, or bend the reflection sheet. P-chassis Lamp unit (R) Figure 4-71 Replacing 15.0 Inch Sharp fluorescent lamp (XGA) (10)
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4.23 Fluorescent Lamp 4 Replacement Procedures Assembling the 15.0 Inch XGA Sharp Fluorescent Lamp To assemble the 15.0-inch Sharp XGA fluorescent lamp, follow the steps below and refer to Figures 4-72 to 4-84. 1. Stick the four double-sided tapes (N, O, P, Q) on the P-chassis. Standard for edge of P-chassis Do not make the P-chassis over this line.
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4 Replacement Procedures 4.23 Fluorescent Lamp 2. Turn the backlight unit face down and install a new lamp unit (R) on the P-chassis. NOTE: When install the lamp unit (R), be careful not to bend or damage the reflection sheet. P-chassis (R) Lamp unit Figure 4-73 Replacing 15.0 Inch Sharp fluorescent lamp (XGA) (12)
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4.23 Fluorescent Lamp 4 Replacement Procedures 3. Install the lamp cover (J) on the backlight unit and secure it with the two screws (D). (J) Lamp cover Screw tightening torque: 1.0kg•cm (D) Screw (D) Screw Figure 4-75 Replacing 15.0 Inch Sharp fluorescent lamp (XGA) (14) 4.
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4 Replacement Procedures 4.23 Fluorescent Lamp 5. Place the lens sheet (L) and upper diffusion sheet (K) on the backlight unit with light guide(M). (K) Upper diffusion sheet L) Lens sheet (M) Light guide Do not make any sheet over the edge of P-chassis.
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4.23 Fluorescent Lamp 4 Replacement Procedures NOTE: Make sure there is no dust between the LCD panel and backlight unit. If any dust is found, remove it with crepe tape or others which has no remaining of paste. (I) LCD panel Guide rib Guide rib (H) Backlight unit...
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4 Replacement Procedures 4.23 Fluorescent Lamp 7. Bend the TCP attaching to the source board and secure it with the two screws. Do not hold the edge. Do not hold the edge. Figure 4-79 Replacing 15.0 Inch Sharp fluorescent lamp (XGA) (18) Screw Screw Figure 4-80 Replacing 15.0 Inch Sharp fluorescent lamp (XGA) (19)
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4.23 Fluorescent Lamp 4 Replacement Procedures 8. Install the bezel (E) on the lamp cover and hook the four latches on the lamp cover and two latches on the P-chassis. (E) Bezel (1) Hitch the hook of the bezel on the rib of the P-chassis. <Side view>...
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4 Replacement Procedures 4.23 Fluorescent Lamp 9. Secure the sides of the unit with the four screws. Screw Screw Screw Screw Figure 4-83 Replacing 15.0 Inch Sharp fluorescent lamp (XGA) (22) 4-96 [CONFIDENTIAL] Satellite A50S/TECRA A3X Maintenance Manual (960-534)
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4.23 Fluorescent Lamp 4 Replacement Procedures 10. Stick the protection cover G (B), protection cover S (A), fixing tape (C) and fixing tape for lead wire (D). 0 to 1 mm Do not make the tape over the top of the module. The tape MUST NOT appear on the display.
Replacement Procedures 4.23 Fluorescent Lamp 4.23.3 Replacing the 15.0 Inch XGA LG.Philips Fluorescent lamp CAUTION: When replacing the fluorescent lamp, wear finger covers or gloves to avoid contaminating or damaging the LCD panel. Be careful not to let dust or other foreign substance into the module.
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4.23 Fluorescent Lamp Replacement Procedures 2. Remove the top case. Be careful not to apply excessive force to the source TCP and gate COF. Top case Figure 4-86 Replacing 15.0 Inch LG.Philips fluorescent lamp (XGA) (2) Satellite A50S/TECRA A3X Maintenance Manual (960-534) [CONFIDENTIAL] 4-99...
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Replacement Procedures 4.23 Fluorescent Lamp 3. Remove the source PCB. 1) Remove the source PCB. Be careful not to apply excessive force to the PCB and TCP. Figure 4-87 Replacing 15.0 Inch LG.Philips fluorescent lamp (XGA) (3) 4-100 [CONFIDENTIAL] Satellite A50S/TECRA A3X Maintenance Manual (960-534)
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4.23 Fluorescent Lamp Replacement Procedures 4. Remove the board assembly, adhesive tape, light guide and cover assembly bottom. 1) Remove the board assembly. 2) Remove the adhesive tape securing the sheets (four points). 3) Remove the sheets and light guide. NOTE: No penetration of foreign object is indispensable not to scratch the sheets.
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Replacement Procedures 4.23 Fluorescent Lamp Assembling the 15.0-inch XGA LG.Philips Fluorescent lamp To assemble the 15.0-inch XGA LG.Philips fluorescent lamp, follow the steps below and refer to Figures 4-89 to 4-92. 1. Install the cover assembly bottom, sheets, light guide, adhesive tape and board assembly.
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4.23 Fluorescent Lamp Replacement Procedures 2. Install the source PCB. 1) Install the source PCB. Be careful not to apply excessive force to the TCP. Figure 4-90 Replacing 15.0 Inch LG.Philips fluorescent lamp (XGA) (6) 3. Install the top case. Figure 4-91 Replacing 15.0 Inch LG.Philips fluorescent lamp (XGA) (7) Satellite A50S/TECRA A3X Maintenance Manual (960-534) [CONFIDENTIAL]...
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Replacement Procedures 4.23 Fluorescent Lamp 4. Stick the outside tape and install the cover shield. 1) Install the cover shield. CAUTION: Wear anti-static gloves to prevent circuit damage to the source PCB. 2) Stick the adhesive tape to fix the top case and B/L wire. Cover shield Cover shield Adhesive tape...
4.23 Fluorescent Lamp Replacement Procedures 4.23.4 Replacing the 15.0 Inch SXGA+ LG.Philips Fluorescent lamp CAUTION: When you replace the fluorescent lamp, wear finger covers or gloves to avoid contaminating or damaging the LCD module. Be careful not to let dust or other foreign substances into the LCD module. Disassembling the 15.0 Inch SXGA+ LG.Philips Fluorescent lamp To disassemble the 15.0-inch SXGA+ LG.Philips fluorescent lamp, follow the steps below and refer to Figures 4-93 to 4-96.
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Replacement Procedures 4.23 Fluorescent Lamp 6. Remove the top case. Be careful not to apply excessive force to the top case or gate TCP. Top case Figure 4-94 Replacing 15.0 Inch LG.Philips fluorescent lamp (SXGA+) (2) 7. Remove the source PCB and gate PCB. 1) Remove the source PCB.
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Replacement Procedures 4.23 Fluorescent Lamp 8. Remove the board assembly, adhesive tape, light guide and cover assembly bottom (L). 1) Remove the board assembly. NOTE: This process should be made in a clean room to prevent scratch or particle on polarizer or B/L assembly.
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4.23 Fluorescent Lamp Replacement Procedures Assembling the 15.0 Inch SXGA+ LG.Philips Fluorescent lamp To assembling the 15.0-inch SXGA+ LG.Philips fluorescent lamp, follow the steps below and refer to figures 4-97 to 4-100. 1. Install the cover assembly bottom (L), sheets, light guide, adhesive tape and board assembly.
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Replacement Procedures 4.23 Fluorescent Lamp NOTE: Be careful not to apply excessive force to the PCB and TCP. Board assembly Adhesive tape Double-sided tape Double-sided tape Adhesive Double-sided tape Double-sided tape Adhesive tape Sheets and light Adhesive tape Screw Screw Cover assembly bottom (L) Figure 4-97 Replacing 15.0 Inch LG.Philips fluorescent lamp (SXGA+) (5) 4-110...
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4.23 Fluorescent Lamp Replacement Procedures 2. Install the source PCB and gate PCB. 1) Install the source PCB. Be careful not to apply excessive force to the TCP. 2) Install the gate PCB. Be careful not to apply excessive force to the TCP. Source PCB Gate PCB Figure 4-98 Replacing 15.0 Inch LG.Philips fluorescent lamp (SXGA+) (6)
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Replacement Procedures 4.23 Fluorescent Lamp Top case Figure 4-99 Replacing 15.0 Inch LG.Philips fluorescent lamp (SXGA+) (7) 4-112 [CONFIDENTIAL] Satellite A50S/TECRA A3X Maintenance Manual (960-534)
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4.23 Fluorescent Lamp Replacement Procedures 4. Stick the out side tape and cover shield. 1) Install the tape shield and adhesive tape to fix the top case. Be careful not to apply excessive force to the top case. 2) Install the cover shield (C). Be careful not to apply excessive force to the control PCB.
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Appendices Appendix Contents Appendix A Handling the LCD Module................. A-1 Appendix B Board Layout....................B-1 System Board Front View................B-1 System Board Back View ................B-3 Sound Board (FLGSN*) ................B-5 Parallel port Board (FLGCP*) ...............B-6 Serial port Board (FLGSR*)................B-7 S-Video Board (FLKCS*) ................B-8 Appendix C Pin Assignment....................
Appendix. A Handling the LCD Module Appendices Appendix. A Appendix A Handling the LCD Module Precautions for handling the LCD module The LCD module can be easily damaged during assembly or disassembly. Observe the following precautions when handling the LCD module: 1.
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Appendices Appendix. A Handling the LCD Module 3. If the panel’s surface gets dirty, wipe it with cotton or a soft cloth. If it is still dirty, try breathing on the surface to create a light condensate and wipe it again. If the surface is very dirty, we recommend a CRT cleaning agent.
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Appendix. A Handling the LCD Module Appendices 5. Glass is used in the panel, so be careful not to drop it or let it strike a hard object, which could cause breakage or cracks. 6. CMOS-LSI circuits are used in the module, so guard against damage from electrostatic discharge.
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Appendices Appendix. A Handling the LCD Module 7. Do not expose the module to direct sunlight or strong ultraviolet rays for long periods. 8. Do not store the module at temperatures below specifications. Cold can cause the liquid crystals to freeze, lose their elasticity or otherwise suffer damage. 9.
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Appendix. A Handling the LCD Module Appendices 10. If you transport the module, do not use packing material that contains epoxy resin (amine) or silicon glue (alcohol or oxime). These materials can release gas that can damage the panel’s polarization. Satellite A50S/TECRA A3X Maintenance Manual (960-534) [CONFIDENTIAL]...
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Appendices Appendix. A Handling the LCD Module [CONFIDENTIAL] Satellite A50S/TECRA A3X Maintenance Manual (960-534)
Appendix. B Board Layout Appendices Appendix. B Appendix B Board Layout System Board Front View Figure B-1 System board layout (front) Satellite A50S/TECRA A3X Maintenance Manual (960-534) [CONFIDENTIAL]...
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Appendices Appendix. B Board Layout Table B-1 System board ICs and connectors (front) Mark Number Name CN8770 Fan cable I/F connector CN5000 LCD harness connector CN3280 Membrane SW I/F connector PJ3502 FLGCP*/FLGSR* I/F connector CN3240 Touch pad connector CN3200 Keybaord connector CN3290 Debuging port connector IC1600...
Appendices Appendix. B Board Layout Parallel port Board (FLGCP*) Figure B-4 Parallel port Board (FLGCP*) layout Table B-4 Parallel port Board (FLGCP*) connectors Mark Number Name CN4613 Parallel port CN4622 USB connector CN3503 System board I/F connector CN4620 USB harness connector [CONFIDENTIAL] Satellite A50S/TECRA A3X Maintenance Manual (960-534)
Appendix. B Board Layout Appendices Serial port Board (FLGSR*) Figure B-5 Serial port Board (FLGSR*) layout Table B-5 Serial port Board (FLGSR*) connectors Mark Number Name CN3440 Serial port CN4632 USB connector CN3504 System board I/F connector CN4630 USB harness connector Satellite A50S/TECRA A3X Maintenance Manual (960-534) [CONFIDENTIAL]...
Appendices Appendix. D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (2/4) Code set 1 Code set 2 Keytop Note Make Break Make Break Caps Lock ‘ “ Enter Shift (L) No.102 , < . > Shift (R) [CONFIDENTIAL] Satellite A50S/TECRA A3X Maintenance Manual (960-534)
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Appendix. D Keyboard Scan/Character Codes Appendices Table D-1 Scan codes (set 1 and set 2) (3/4) Code set 1 Code set 2 Keytop Note Make Break Make Break Ctrl Alt (L) Space ALT (R) ← Home ↑ ↓ PgUp PgDn →...
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Appendices Appendix. D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (4/4) Code set 1 Code set 2 Keytop Note Make Break Make Break PrintSc Pause — — — — Notes: 1. * Scan codes differ by mode. 2.
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Appendix. D Keyboard Scan/Character Codes Appendices Table D-2 Scan codes with left Shift key Code set 1 Code set 2 Make Break Make Break E0 AA E0 35 E0 B5 E0 2A E0 F0 12 E0 4A E0 F0 4A E0 12 E0 AA E0 52 E0 D2 E0 2A E0 F0 12 E0 70 E0 F0 70 E0 12...
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Appendices Appendix. D Keyboard Scan/Character Codes Table D-3 Scan codes in Numlock mode Code set 1 Code set 2 Make Break Make Break E0 2A E0 52 E0 D2 E0 AA E0 12 70 E0 F0 70 E0 F0 12 E0 2A E0 53 E0 D3 E0 AA E0 12...
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Appendix. D Keyboard Scan/Character Codes Appendices Table D-5 Scan codes in overlay mode Code set 1 Code set 2 Keytop Make Break Make Break (–) Table D-6 No.124 key scan code Code set 1 Code set 2 Shift Make Break Make Break Prt Sc...
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Appendices Appendix. D Keyboard Scan/Character Codes Table D-7 No.126 key scan code Shift Code set 1 Code set 2 Make Make Pause Common E1 1D E1 F0 Ctrl* E0 46 7E E0 F0 *: This key generates only make codes. [CONFIDENTIAL] Satellite A50S/TECRA A3X Maintenance Manual (960-534)
Appendix. G BIOS/KBC/EC Update Appendices Appendix. G BIOS Rewrite Procedures Appendix G BIOS/KBC/EC Update To update the BIOS, KBC or EC, insert the FD for update into the FDD. Then turn on the power of the computer while pressing the following key until the power LED blinks. For BIOS update: (tilde key ;...
Appendix. H Reliability Appendices Appendix. H Reliability Appendix H Reliability The following table shows the MTBF (Mean Time Between Failures) of system. Table H-1 MTBF Component Time (hours) System (maximum configuration) 6,811 System (minimum configuration ) 6,822 Satellite A50S/TECRA A3X Maintenance Manual (960-534) [CONFIDENTIAL]...