TABLE OF CONTENTS
1.
······································································ 2
2.
2-2. Main Board ········································································· 4
2-3. Cassette Lid ········································································ 4
3.
4.
5.
DIAGRAMS
5-1. Block Diagram ··································································· 8
5-6. IC Block Diagrams ··························································· 24
6.
EXPLODED VIEWS
6-1. Cabinet Section ································································· 25
6-2. Main Board Section ·························································· 27
6-3. Mechanism Section-1 ······················································· 28
6-4. Mechanism Section-2 ······················································· 29
7.
• LOCATION OF CONTROL
······························ 6
································ 6
··································· 30
SECTION 1
GENERAL
- 2 -
Flexible Circuit Board Repairing
•
Keep the temperature of the soldering iron aroud 270˚ C during
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
This section is extracted
from instruction manual.