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NOTE: “Note” contains general information that relates to your safe maintenance service. Improper repair of the computer may result in safety hazards. Toshiba requires service technicians and authorized dealers or service providers to ensure the following safety precautions are adhered to strictly.
The manual is divided into the following parts: Chapter 1 Hardware Overview describes Satellite A50/TECRA A2 series system unit and each FRU. Chapter 2 Troubleshooting Procedures explains how to diagnose and resolve FRU problems. Chapter 3 Test and Diagnostics describes how to perform test and diagnostic operations for maintenance service.
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Conventions This manual uses the following formats to describe, identify, and highlight terms and operating procedures. Acronyms On the first appearance and whenever necessary for clarification acronyms are enclosed in parentheses following their definition. For example: Read Only Memory (ROM) Keys Keys are used in the text to describe many operations.
Table of Contents Chapter 1 Hardware Overview Features ........................1-1 System Block Diagram ....................1-6 3.5-inch USB Floppy Disk Drive ................1-10 2.5-inch Hard Disk Dr ive..................1-11 CD-ROM Drive......................1-16 DVD-ROM Drive ....................1-17 DVD-ROM & CD-R/RW Drive ................1-18 DVD-R/-RW Drive ....................
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2.12 LAN Troubleshooting ....................2-45 2.13 Sound Troubleshooting .................... 2-46 2.14 Wireless LAN Troubleshooting................2-48 Chapter 3 Tests and Diagnostics The Diagnostic Test....................3-1 Executing the Diagnostic Test ................... 3-3 Setting of the hardware configuration................ 3-7 Subtest Names......................3-9 System Test......................3-11 Memory Test......................
1 Hardware Overview Chapter 1 Contents Features ........................1-1 System Block Diagram ....................1-6 3.5-inch USB Floppy Disk Drive ................1-10 2.5-inch Hard Disk Drive..................1-11 CD-ROM Drive......................1-16 DVD-ROM Drive ....................1-17 DVD-ROM & CD-R/RW Drive ................1-18 DVD-R/-RW Drive ....................1-20 DVD Super Multi Drive...................
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1 Hardware Overview Figures Figure 1-1 Front of the computer..................1-4 Figure 1-2 System units configuration ................1-5 Figure 1-3 System block diagram..................1-6 Figure 1-4 3.5-inch USB FDD..................1-10 Figure 1-5 2.5-inch HDD....................1-11 Figure 1-6 CD-ROM Drive .................... 1-16 Figure 1-7 DVD-ROM Drive ..................
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1.1 Features 1 Hardware Overview Features Features The Satellite A50/TECRA A2 is a high performance all- in-one PC running a Pentium M or Celeron M processor. Features are listed below. q Microprocessor [CPU Easy Replaceable] Microprocessor used is different from each model. ®...
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1 Hardware Overview 1.1 Features q USB FDD The two- mode 3.5- inch USB FDD supports 720KB, and 1.44MB formats. q Display Built- in 14.1- or 15.0-inch, XGA (1,024 x 768 dots), or 15- inch, SXGA+ (1,400 x 1,050 dots), 262,144 colors, amorphous silicon TFT color display. Supported via an RGB connector.
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1.1 Features 1 Hardware Overview q Sound system The computer has an external monaural microphone connector, stereo headphone connector and internal stereo speakers. Wireless LAN (Mini PCI slot) The wireless LAN (802.11b, 802.11g or 802.11a/g) is equipped on the mini PCI s lot. q LAN/MODEM Connectors for LAN and Modem are separately mounted.
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1 Hardware Overview 1.1 Features Figure 1-1 shows the front of the computer. Figure 1-1 Front of the computer Satellite A50/TECRA A2 Maintenance Manual (960-478)
1.1 Features 1 Hardware Overview Figure 1-2 shows the system units configuration. Figure 1-2 System units configuration Satellite A50/TECRA A2 Maintenance Manual (960-478)
1 Hardware Overview 1.2 System Block Diagram System Block Diagram Figure 1-3 shows the system block diagram. Figure 1-3 System Block Diagram Satellite A50/TECRA A2 Maintenance Manual (960-478)
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1.2 System Block Diagram 1 Hardware Overview The PC contains the following components. q CPU ® ® Intel Mobile Pentium -M model 1.50/1.60/1.70GHz (Internal clock: 1.50/1.60/1.70GHz, Bus: 400MHz, Core voltage: 1.48/0.88V, Built- in NDP) L1 cache memory: 64KB L2 cache memory: 1024KB ®...
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Deeper Sleep control interface Chipset interface Intel serial interrupt Card Bus /PC card controller (Yenta Version 2.2: 1 slot) Parallel power control (Toshiba style) SD memory card controller (SDHC Version 1.2) SD IO card controller (Version 1.1) Smart Card interface debug port...
1.2 System Block Diagram 1 Hardware Overview q VGA controller Imbedded in North Bridge q Super I/O (SMSC- made LPC-47n277-MN) FDC (765B FDC) Parallel port control (PS/2 bi-directional compatible, EPP compatible, IEEE1284 ECP) q Other main system chips EC/KBC (SMSC-made LPC microcontroller LPC47N259 x 1) PSC (Tos hiba- made TMP87PM48U x 1) Thermal sensor (AnalogDevice- made ADM1032 x 1) Audio AMP (Mitsumi-made MM1517X x1)
1 Hardware Overview 1.3 3.5-inch USB Floppy Disk Drive 3.5-inch USB Floppy Disk Drive This compact, lightweight and high-reliability FDD can be used with 720KB and 1.44MB floppy disks. Figure 1-4 shows the 3.5- inch FDD. Table 1-1 lists the specifications. Figure 1-4 3.5-inch USB FDD Table 1-1 3.5-inch USB FDD specifications Item...
Figure 1-5 shows a view of the 2.5- inch HDD and Tables 1-2 and 1-3 list the dimensions and specifications. Figure 1-5 2.5-inch HDD Table 1-2 2.5-inch HDD dimensions (1/5) Standard Item TOSHIBA HDD2187B HDD2188B HDD2189B HDD2190B HDD2191B HDD2193B HDD2194B Width (mm) 69.85 Height (mm) Depth (mm) 100.0...
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1 Hardware Overview 1.4 2.5-inch Hard Disk Drive Table 1-3 2.5-inch HDD Specifications (3/5) Specifications Item HITACHI G8BC0000Z310 G8BC0000Z311 G8BC0000Z411 G8BC0000Z611 Storage size (formatted) 30GB 30GB 40GB 60GB Rotation speed (RPM) 4,200 Data transfer rate (MB/s) 350 (max) Interface transfer rate (MB/s) Storage density (Kbpi) Track density (Ktpi) Average random seek time...
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1.4 2.5-inch Hard Disk Drive 1 Hardware Overview Table 1-3 2.5-inch HDD Specifications (5/5) Specifications Item SEAGATE G8BC0001F410 Storage size (formatted) 40GB Rotation speed (RPM) 4,200 Data transfer rate (MB/s) Interface transfer rate (MB/s) Storage density (Kbpi) Track density (Ktpi) 100.7 Average random seek time (read) (ms)
1 Hardware Overview 1.5 CD-ROM Drive CD-ROM Drive The CD-ROM drive accommodates either 12 cm (4.72- inch) or 8 cm (3.15- inch) CD. It is a high-performance drive that reads at maximum 24-speed (3,600 KB per second). The CD-ROM drive is shown in Figure 1-6. The specifications of the CD-ROM drive are described in Table 1-4.
CD at maximum 24-speed (3,600 KB per second). The DVD-ROM drive is shown in Figure 1-7. The specifications of the DVD-ROM drive are described in Table 1-5. Figure 1-7 DVD-ROM drive Table 1-5 DVD-ROM drive dimensions Specifications Toshiba G8CC0000R810 Item DVD-ROM CD-ROM DVD-RAM 16.7 (PIO Mode 4) Burst data transfer rate 16.7 (Multi-word DMA Mode 2)
DVD-R at 2-speed, and reads CD at maximum 24-speed (3,600 KB per second). The DVD-R/-RW drive is shown in Figure 1-9. The specifications of the DVD-R/-RW drive are described in Table 1-7. Figure 1-9 DVD-R/-RW drive Table 1-7 DVD-R/-RW drive specifications Specifications Toshiba G8CC0000ZH10(SDR61120AF) Item DVD-ROM CD-ROM DVD-RAM 33.3 (Ultra DMA) Burst data transfer rate 16.7 (PIO mode 4)
1.9 DVD Super Multi drive 1 Hardware Overview DVD Super Multi drive The DVD Multi drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15- inch) CD, CD- R/RW and DVD. It is a high-performance drive that reads CD at maximum 24-speed (3,600 KB per second) and writes DVD-RW at 2-speed, DVD-RAM at 2-speed, DVD-R at4-speed, DVD+R at 2.4-speed and DVD+RW at 2.4-speed.
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1 Hardware Overview 1.9 DVD Super Multi drive Table 1-8 DVD Multi drive specifications (2/2) Specification TEAC G8CC0001U210 Item DVD-ROM CD-ROM DVD-RAM 33.3 (Ultra DMA mode 2) Burst data transfer rate 16.6 (PIO Mode 4, Multi-word DMA mode 2) (MB/s) Access time (ms) 1/3 Stroke Access (typ.) Data buffer capacity...
1.10 Keyboard 1 Hardware Overview 1.10 Keyboard An 85(US)-/86(UK)- key (101 emulatio n) keyboard is mounted on the system unit. The keyboard is connected to membrane connector on the system board and controlled by the keyboard controller. Figure 1-11 shows a view of the keyboard. See Appendix E for details of the keyboard layout.
1 Hardware Overview 1.11 TFT Color Display 1.11 TFT Color Display The TFT color display has a 14.1- inch (XGA) or 15.0-inch (XGA, SXGA+) LCD module and the FL inverter board. 1.11.1 LCD Module The LCD module used for the TFT color display uses a backlight as the light source and can display a maximum of 262,144 colors with 1,024 x 768 or 1,400 x 1,050 resolution.
1.11 TFT Color Display 1 Hardware Overview 1.11.2 FL Inverter Board The FL inverter board supplies a high frequency current to illuminate the LCD module FL. Table 1-10 lists the FL inverter board specifications. Table 1-10 FL inverter board specifications Item Specifications Voltage (V)
1 Hardware Overview 1.12 Power Supply 1.12 Power Supply The power supply supplies 20 different voltages to the system board. The power supply microcontroller has the following functions. 1. Judges if the DC power supply (AC adapter) is connected to the computer. 2.
1 Hardware Overview 1.13 Batteries 1.13 Batteries The PC has the following two batteries. q Main battery q Real time clock (RTC) battery Table 1-12 lists the specifications for these two batteries. Table 1-12 Battery specifications Battery Name Material Output Voltage Capacity G71C0003U210 lithium ion...
1.13 Batteries 1 Hardware Overview 1.13.2 Battery Charging Control Battery charging is controlled by a power supply microprocessor. The power supply microprocessor controls power supply and detects a full charge when the AC adaptor and battery are connected to the computer. q Battery Charge When the AC adapter is connected, normal charging is used while the system is turned on, and quick charge is used while the system is turned off or in suspend mode.
1 Hardware Overview 1.13 Batteries q Battery preservation time When turning off the power in being charged fully, the preservation time is as follows: Table 1-14 Battery preservation time Condition Preservation Time Normal charge 3cell About 10 days 6cell About 25 days 12cell About 55 days Quick charge...
1.13 Batteries 1 Hardware Overview 1.13.3 RTC Battery The RTC battery provides the power supply to maintain the date, time, and other system information in memory. Table 1-15 lists the Time required for charges of RTC battery. Table 1-15 Time required for charges of RTC battery Condition Time Power ON (Lights Power LED)
1 Hardware Overview 1.14 AC Adapter 1.14 AC Adapter The AC adapter is used to charge the battery. Table 1-16 lists the AC adapter specifications. Table 1-16 AC adapter specifications Item Specifications G71C0002S310 Input voltage 100V/240V Input frequency 50Hz/60Hz No load input power 0.5W or less Output voltage 15.0V...
2 Troubleshooting Procedures Figures Figure 2-1 Troubleshooting flowchart ................2-3 Figure 2-2 A set of tool for debug port test ..............2-20 Tables Table 2-1 Battery icon....................2-6 Table 2-2 DC IN icon..................... 2-7 Table 2-3 D port status ....................2-21 Table 2-4 FDD error code and status ................
12. External USB cable 13. External USB mouse 14. Headphone 15. Microphone 16. Toshiba CD-ROM test disk (ZA1217P01/P000204190) 17. Toshiba-EMI DVD-ROM test disk TSD-1 18. Music CD 19. CD-RW media (recommended :RICOH, Mitsubishi Kagaku supporting 4x media) 20. DVD-ROM media (normal media on the market) 21.
Before going through the flowchart steps, check the following: ® q Make sure that Toshiba Windows 2000/XP-HE/XP-PRO is installed on the hard disk. Non-Toshiba operating systems can cause the computer malfunction. q Make sure all optional equipment is removed from the computer. Satellite A50/TECRA A2 Maintenance Manual (960-478)
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2.2 Troubleshooting Flowchart 2 Troubleshooting Procedures If the diagnostics program cannot detect an error, the problem may be intermittent. The Test program should be executed several times to isolate the problem. Check the Log Utilities function to confirm which diagnostic test detected an error(s), then perform the appropriate troubleshooting procedures as follows: 1.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting Power Supply Troubleshooting The power supply controller controls many functions and components. To determine if the power supply is functioning properly, start with Procedure 1 and continue with the other Procedures as instructed. The procedures described in this section are: Procedure 1: Power Status Check Procedure 2: Error Code Check Procedure 3: Connection Check...
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2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures Table 2-2 DC IN icon DC IN icon Power supply status Lights green DC power is being supplied from the AC adapter. Blinks orange Power supply malfunction Doesn’t light Any condition other than those above. *1 When the power supply controller detects a malfunction, the DC IN icon blinks orange.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting Procedure 2 Error Code Check If the power supply microprocessor detects a malfunction, the DC IN icon blinks orange. The blink pattern indicates an error as shown below. q Start Off for 2 seconds q Error code (8 bit) “1”...
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2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting q Main Battery Error code Meaning Main battery charge current is over 7.00A. Main battery discharge current is over 0.5A when there is no load. Main battery charge current is over 3.9A when AC adapter is not connected.
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2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures q 1R5-C1V output (P62) Error code Meaning 1R5-C1V voltage is over 1.50V when the computer is powered on/off. 1R5-C1V voltage is 1.275V or less when the computer is powered on. 1R5-C1V voltage is 1.275V or less when the computer is booting up. 1R5-C1V voltage is 1.275V or less while the computer is suspended.
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2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting q E5V output (P65) Error code Meaning E5V voltage is over 6.00V when the computer is powered on/off. E5V voltage is 4.50V or less when the computer is powered on. E5V voltage is 4.50V or less when the computer is booting up. E5V voltage is 4.50V or more when the computer is powered off.
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2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures q 1R25-B1V output (P65) Error code Meaning 1R25-B 1V voltage is over 1.50V when the computer is powered on/off. 1R25-B 1V voltage is 1.063V or less when the computer is powered on. 1R25-B 1V voltage is 1.063V or less when the computer is booting up. 1R25-B 1V voltage is 1.063V or more when the computer is powered off.
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2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting Check 2 In the case of error code 10h or 12h: q Make sure the AC adapter and AC power cord are firmly plugged into the DC IN 15 V socket and wall outlet. If the cables are connected correctly, go to the following step: q Connect a new AC adapter and AC power cord.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures Procedure 3 Connection Check The wiring diagram related to the power supply is shown below: Any of the connectors may be disconnected. Perform Check 1. Check 1 Make sure the AC adapter and the AC power cord are firmly plugged into the DC IN 15 V socket and wall outlet.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting Procedure 5 Replacement Check The power is supplied to the system board by the AC adapter. If either the AC adapter or the system board was damaged, perform the following Checks. To disassemble the computer, follow the steps described in Chapter 4, Replacement Procedures.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures System Board Troubleshooting This section describes how to determine if the system board is defective. Start with Procedure 1 and continue with the other procedures as instructed. The procedures described in this section are: Procedure 1: Message Check Procedure 2: Debug Port Check Procedure 3: Diagnostic Test Program Execution Check...
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Procedure 1 Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. The IRT tests each IC on the system board and initializes it. q If an error message is shown on the display, perform Check 1.
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2.4 System Board Troubleshooting 2 Troubleshooting Procedures If one of the following error messages (1) through (17), (24) or (25) is displayed, go to Procedure 4. If error message (18) is displayed, go to the Keyboard Troubleshooting Procedures in Section 2.7. If error message (19), (20) or (21) is displayed, go to the 2.5”...
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Procedure 2 Debug Port Check Check the D port status by a debug port test. The tool for debug port test is shown below. Figure 2-2 A set of tool for debug port test The test procedures are follows;...
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-3 D port status (1/9) D port Inspection items Details status Enabling address line A20 and Clearing a software reset bit Prohibition of APIC Initializing MCHM Initializing ICHM Initializing Super I/O Initializing debug port Dummy read of 3 Bus data Setting of printer port (Only for the model supporting PRT)
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2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-3 D port status (2/9) D port Inspection items Details status F005h Executing CHGBIOSA Storing key scan code Setting up TASK_1ms_TSC Controlling Fan Initializing sound systems (For beep sound) Enabling system speaker Canceling mute Maximizing volume When BIOS,EC/KBC is requested to be rewritten...
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2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-3 D port status (3/9) D port Inspection items Details status F100h Disabling cache Initializing H/W (before recognizing DRAM) Initializing MCHM Initializing ICH4M.D31.Func0 Initializing ICH4M.D31.Func1 Initializing USB.Func0,1,2,7 Initializing ICH4M.D31.Func3 Initializing ICH4M.D31.Func5 Initializing FLUTE Initializing the channel 1 of a PIT (set 30 µs for refresh interval) F101h...
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2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-3 D port status (4/9) D port Inspection items Details status (F103h) Checking the change of memory configuration Resume error F173H Checking CheckSum of RAM area of system BIOS Resume error F179H Checking CheckSum of expanded memory (Montara) Resume error F176H Checking CheckSum of PnP RAM...
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2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-3 D port status (5/9) D port Inspection items Details status (F105h) Measuring the clock speed of a CPU Permission of SMI except auto-off function Control the excess of the rated input power Battery discharge current control (1CmA) AC adapter rated over current control Dividing procedures for time measuring of IRT...
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2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-3 D port status (6/9) D port Inspection items Details status F107h Initializing PCI Initializing PCI BUS (connecting DS Bus) Initializing a LAN Initializing information of LAN Checking the factor of WakeUp F108h Running a task of waiting for the end of INIT_PCI Initializing the data in CMOS (2)
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2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-3 D port status (7/9) D port status Inspection items Details F10Eh INIT_SYSTEM Storing CMOS error information in IRT_ERR_STS_BUF (Initialization of system) Timer initialization start Initializing an EC, and reading battery information Updating system BIOS (Updating EDID of the LCD) F10Fh Initializing the display...
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2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-3 D port status (8/9) D port status Inspection items Details F11Eh PRE_BOOT_SETUP Storing the value in 40:00h (for SIO saving/restoring) Setting up the address of font data for resume password Setting up the parameters for character repeat on a USB keyboard Final check of key input during IRT Storing of T_SHADOW_RAM_SIZE...
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2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-3 D port status (9/9) D port status Inspection items Details Process for CPU (Make the CPU clock to be set by SETUP) Waiting for the motor off of a disabled HDD Final decision of USB FDD drive information Post processing of PRE_BOOT_SETUP Clearing PWRBTN_STS, Enabling the power button...
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Procedure 3 Diagnostic Test Program Execution Check Execute the following tests from the Diagnostic Test Menu. These tests check the system board. Refer to Chapter 3, Tests and Diagnostic, for more information on how to perform these tests.
2.5 3.5” FDD Troubleshooting 2 Troubleshooting Procedures 3.5” FDD Troubleshooting This section describes how to determine if the 3.5” FDD is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required. Procedure 1: FDD Head Cleaning Check Procedure 2: Diagnostic Test Program Execution Check Procedure 3: Connector Check and Replacement Check Procedure 1...
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2 Troubleshooting Procedures 2.5 3.5” FDD Troubleshooting Procedure 2 Diagnostic Test Program Execution Check Insert the Diagnostics Disk in the USB FDD, turn on the computer and run the test. Refer to Chapter 3, Tests and Diagnostics, for more information about the diagnostics test procedures.
2.5 3.5” FDD Troubleshooting 2 Troubleshooting Procedures Procedure 3 Connector Check and Replacement Check The USB connector may be disconnected from the system board. Check visually that the connector is connected firmly. Check 1 Make sure the following cable and connector are firmly connected to the system board.
For the backup, refer to the User’s Manual. Procedure 1 Partition Check Insert the Toshiba MS-DOS system disk and start the computer. Perform the following checks: Type C: and press Enter. If you cannot change to drive C, go to Check 2. If Check 1 you can change to drive C, go to Procedure 2.
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2.6 2.5” HDD Troubleshooting 2 Troubleshooting Procedures Procedure 2 Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. When the test detects an error, an error message is displayed on the screen.
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2 Troubleshooting Procedures 2.6 2.5” HDD Troubleshooting Procedure 3 Format Check The computer’s HDD is formatted using the MS-DOS FORMAT program or the physical format program of the test program. To format the HDD, start with Check 1 below and perform the other steps as required.
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2.6 2.5” HDD Troubleshooting 2 Troubleshooting Procedures Procedure 4 Diagnostic Test Program Execution Check The HDD test program is stored in the Diagnostics Disk. Perform all of the HDD tests in the Hard Disk Drive Test. Refer to Chapter 3, Tests and Diagnostics, for more information about the HDD test program.
2 Troubleshooting Procedures 2.6 2.5” HDD Troubleshooting Procedure 5 Connector Check and Replacement Check The HDD is connected to the connector of the system board. The connecting portion may be disconnected. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform the following checks to check the connecting portion: Check 1...
2.7 Keyboard Troubleshooting 2 Troubleshooting Procedures Keyboard Troubleshooting To determine if the computer’s keyboard is functioning properly, perform the following procedures. Start with Procedure 1 and continue with the other procedures as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check...
2 Troubleshooting Procedures 2.8 Display Troubleshooting Display Troubleshooting This section describes how to determine if the computer’s display is functioning properly. Start with Procedure 1 and continue with the other procedures as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector and Cable Check Procedure 3: Replacement Check Procedure 1...
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2.8 Display Troubleshooting 2 Troubleshooting Procedures Procedure 3 Replacement Check The display unit has an FL inverter board, Display module, System board, LCD harness and Display ON/OFF switch. Any of the components may be damaged. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures? then perform the following checks: If characters or graphics are not displayed on the internal display, perform Check 1.
2 Troubleshooting Procedures 2.9 Touch Pad Troubleshooting Touch Pad Troubleshooting To determine whether the Touch Pad is faulty or not, perform the following procedures: Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector and Cable Check Procedure 3: Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Touch Pad Test in the Diagnostic Program.
2.10 Optical Drive Troubleshooting 2 Troubleshooting Procedures 2.10 Optical Drive Troubleshooting To check if the optical drive (CD-ROM, DVD-ROM, DVD-ROM & CD-R/RW, DVD-R/- RW or DVD Super Multi drive) is defective or malfunctioning, follow the troubleshooting procedures below as instructed. Procedure 1 Diagnostic Test Program Execution Check Procedure 2 Connector Check and Replacement Check Procedure 1...
2 Troubleshooting Procedures 2.11 Modem Troubleshooting 2.11 Modem Troubleshooting To check if the modem is defective or malfunctioning, follow the troubleshooting procedures below as instructed. Procedure 1 Diagnostic Test Program Execution Check Procedure 2 Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Modem Test in the Diagnostic Program.
2.12 LAN Troubleshooting 2 Troubleshooting Procedures 2.12 LAN Troubleshooting To check if the computer’s LAN is defective or malfunctioning, follow the troubleshooting procedures below as instructed. Procedure 1 Diagnostic Test Program Execution Check Procedure 2 Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the LAN Test in the Diagnostic Program.
2 Troubleshooting Procedures 2.13 Sound Troubleshooting 2.13 Sound Troubleshooting To check if the sound function is defective or malfunctio ning, follow the troubleshooting procedures below as instructed. Procedure 1 Diagnostic Test Program Execution Check Procedure 2 Connector Check Procedure 3 Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Sound Test in the Diagnostic Program.
2.13 Sound Troubleshooting 2 Troubleshooting Procedures Procedure 3 Replacement Check Check 1 The speaker may be faulty. Replace it with a new one following the steps in Chapter 4. If the problem persists, perform Check 4. Check 2 The sound board may be faulty. Replace it with a new one following the steps in Chapter 4.
2 Troubleshooting Procedures 2.14 Wireless LAN Troubleshooting 2.14 Wireless LAN Troubleshooting This section describes how to determine if the computer's Wireless LAN is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required. Procedure 1: Transmitting- Receiving Check Procedure 2: Antennas' Connection Check Procedure 3: Replacement Check...
2.14 Wireless LAN Troubleshooting 2 Troubleshooting Procedures Procedure 2 Antennas' Connection Check The wireless LAN function-wiring diagram is shown below: Any of the connections may be disconnected. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure the wireless communication switch is “On”.
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3 Tests and Diagnostics Chapter 3 Contents The Diagnostic Test ....................3-1 3.1.1 Diagnostics menu ................. 3-1 3.1.2 H/W (Hardware) initial information setting tool........3-2 Executing the Diagnostic Test ................... 3-3 3.2.1 Diagnostics menu (T&D) ..............3-3 3.2.2 H/W (Hardware) initial information setting tool........3-6 Setting of the hardware configuration................
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3 Tests and Diagnostics 3.25 Log Utilities ......................3-57 3.25.1 Function Description................3-57 3.25.2 Operations ................... 3-57 3.26 Running Test......................3-59 3.26.1 Function Description................3-59 3.26.2 Operations ................... 3-59 3.27 Floppy Disk Drive Utilities..................3-61 3.27.1 Function Description................3-61 3.27.2 Operations ...................
3.1 The Diagnostic Test 3 Tests and Diagnostics Tests and Diagnostics The Diagnostic Test This chapter explains how to use the Diagnostic Test programs to test the functions of the computer’s hardware modules. The Diagnostics Programs are stored on some Diagnostic Disks. There are Service Program Modules (DIAGNOSTIC MENU) and the Test Program Modules (DIAGNOSTIC TEST MENU) on the Diagnostic Disk.
A PC card wraparound connector (Expansion test) q An external CRT monitor (Expansion test) q A CD test media (TOSHIBA CD-ROM TEST DISK) (CD-ROM/DVD-ROM test) q A DVD test media (DVD-ROM TEST DISK TSD-1) (CD-ROM/DVD-ROM test) q A music CD (CD-ROM/DVD-ROM test)
To start the H/W initial information setting tool, press 2 and Enter. 3.2.1 Diagnostics menu (T&D) The following menu appears. TOSHIBA personal computer XXXXXX DIAGNOSTICS version X.XX (c) copyright TOSHIBA Corp. 20XX DIAGNOSTICS MENU : 1 - DIAGNOSTIC TEST 4 - HEAD CLEANING 5 - LOG UTILITIES...
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Set the highlight bar to 1, and press Enter. The following DIAGNOSTIC TEST MENU will appear: TOSHIBA personal computer XXXXXX DIAGNOSTICS version X.XX (c) copyright TOSHIBA Corp. 20XX DIAGNOSTIC TEST MENU : 1 - SYSTEM TEST 2 - MEMORY TEST...
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3.2 Executing the Diagnostic Test 3 Tests and Diagnostics Select the option you want to execute and press Enter. When you select 1- SYSTEM TEST, the following message will appear: SYSTEM TEST NAME xxxxxxx DIAGNOSTIC TEST VX.XX XXXXXXX [Ctrl]+[Break] ; test end [Ctrl]+[C] ;...
3 Tests and Diagnostics 3.2 Executing the Diagnostic Test Use the up and down arrow keys to move the cursor to “ERROR STOP”. Use the right and left arrow keys to move the cursor to the desired option and press Enter. Selecting YES of ERROR STOP stops the test program when an error is found and displays the operation guide on the right side of the display screen as shown below: ERROR STATUS NAME...
3.3 Setting of the hardware configuration 3 Tests and Diagnostics Setting of the hardware configuration To execute this program, select 2-Repair initial config test from the startup menu, press Enter and follow the directions on the screen. The H/W initial information setting tool consists of four subtests.
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3 Tests and Diagnostics 3.3 Setting of the hardware configuration Subtest 08 System configuration display This subtest displays the information of the system configuration. When the following message appears, press Enter. Press [Enter] key For details of the system configuration information, refer to "3.28 System configuration".
3.4 Subtest Names 3 Tests and Diagnostics Subtest Names Table 3-1 lists the subtest names for each test program in the DIAGNOSTIC TEST MENU. Table 3-1 Subtest names (1/2) Test Name Subtest No. Subtest Name ROM checksum SYSTEM Dock/UnDock Fan ON/OFF Geyserville Quick charge DMI read...
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3 Tests and Diagnostics 3.4 Subtest Names Table 3-1 Subtest names (2/2) Test Name Subtest No. Subtest Name ASYNC Wraparound (board) Point to point (send) Point to point (receive) Interrupt test FIR/SIR Point to point (send) FIR/SIR Point to point (receive) Sequential read Address uniqueness Random address/data...
3.5 System Test 3 Tests and Diagnostics System Test To execute the System Test, select 1 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter.
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3 Tests and Diagnostics 3.5 System Test Subtest 05 Geyserville This subtest confirms the CPU clock can be changed. When the CPU of the computer is Celeron, the following message appears: *** This chip is not supported. *** Subtest 06 Quick charge This subtest checks the status for the quick charge.
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3.5 System Test 3 Tests and Diagnostics Input the computer’s PCN/bundle number and press Enter. (e.g. PCN0482TOZ01/S2A0281D990) 6. "Write data OK (Y/N)?" When you press Y and Enter, the DMI information is written to the Flash- ROM. Subtest 09 CPU Thirmistor This subtest measures the CPU temperature to see if the cooling functions of the computer are effectively working.
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3 Tests and Diagnostics 3.5 System Test Subtest 11 System LED This subtest checks the LED of Power, Battery and DC-IN. The Following message appears in the display. Confirm that the LED lights in the same color as the message changed in the certain interval.
3.6 Memory Test 3 Tests and Diagnostics Memory Test To execute the Memory Test, select 2 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter.
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3 Tests and Diagnostics 3.6 Memory Test Subtest 05 L2 Cache Memory To test the L2 cache memory, a pass-through write-read comparison of ‘5A’ data is run repeatedly to the test area (‘7000’:’Program’ size to ‘7000’:’7FFF’ (32 KB)) to check the hit-miss ratio (on/off status) for L2 cache memory. Number of misses Number of hits Number of misses Number of hits Fail...
3.7 Keyboard Test 3 Tests and Diagnostics Keyboard Test To execute the Keyboard Test, select 3 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. The Keyboard test contains some subtests that test the computer’s keyboard and Touch pad actions. Move the highlight bar to the subtest you want to execute and press Enter.
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3 Tests and Diagnostics 3.7 Keyboard Test Subtest 04 Touch Pad/IPS This subtest checks the functions of the touch pad as shown below. A) Touch Pad pressure sensing direction and parameter. B) Touch Pad function check. This test displays the response from the touch pad and touch pad switch. When moving your finger on the touch pad towards the upper left, the <POINTING>...
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USB port, an error message appears. Check the wraparound connection and repeat the test. Subtest 07 Button test This subtest checks TOSHIBA Console button, Presentation button, Zoom in(+) button and Zoom out(-) button work properly. The following message appears in the display. Press [TOSHIBA Console] key Then, press the TOSHIBA Console button of the computer.
3 Tests and Diagnostics 3.8 Display Test Display Test To execute the Display Test, select 4 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. The Display test contains subtests that test the display in various modes.
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3.8 Display Test 3 Tests and Diagnostics Subtest 04 Gradation & Mode test for VGA This subtest displays gradations for following modes. To change the mode, press Enter. [Mode 12] [Mode 13] [Mode 3] [Mode 111 640*480 64K] [Mode 112 640*480 16M] [Mode 114 800*600 64K] [Mode 115 800*600 16M] [Mode 117 1024*768 64K]...
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3 Tests and Diagnostics 3.8 Display Test Subtest 06 “H” Pattern Display This subtest displays a full screen of “H” patterns. HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH To exit this subtest and return to the DISPLAY TEST menu, press Enter. NOTE: The last row may not be completely filled.
3.9 Floppy Disk Test 3 Tests and Diagnostics Floppy Disk Test NOTE: Before running the floppy disk test, prepare a formatted work disk. Remove the Diagnostics Disk and insert the work disk into the FDD. Otherwise, the contents of the floppy disk will be erased. To execute the Floppy Disk Test, select 5 from the DIAGNOSTIC TEST MENU, press Enter.
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3 Tests and Diagnostics 3.9 Floppy Disk Test Subtest 01 Sequential read This subtest performs a Cyclic Redundancy Check (CRC) that continuously reads all the tracks (track: 0 to 39/0 to 79) on a floppy disk. The start track is specified at the start of the FDD test. Refer to 2 in this chapter.
3.10 Printer Test 3 Tests and Diagnostics 3.10 Printer Test To execute the Printer Test, select 6 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. The Printer Test contains subtests that test the output of the printer connected to the computer.
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3 Tests and Diagnostics 3.10 Printer Test Subtest 02 Function This subtest is for IBM compatible printers, and tests the following functions: Normal print Double-width print Compressed print Emphasized print Double-strike print All characters print This subtest prints the various print types shown below: Subtest 03 Wrap around NOTE: To execute this subtest, a printer wraparound connector must be connected to...
3.11 Async Test 3 Tests and Diagnostics 3.11 Async Test NOTE: This test cannot be performed without Advanced Port Replicator III. Before executing this test, make sure the computer is docked with the Advanced Port Replicator III. To execute the Async Test, select 7 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions displayed on the screen.
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3 Tests and Diagnostics 3.11 Async Test Subtest 02 Point to point (Send) NOTE: To execute this subtest, two machines must be connected with an RS-232C direct cable. One machine should be set as “send”(subtest 02) and the other set as “receive” (subtest 03). The wiring diagram for the RS-232C direct cable is described in Appendix F.
3.12 Hard Disk Test 3 Tests and Diagnostics 3.12 Hard Disk Test To execute the Hard Disk Test, select 8 from the DIAGNOSTIC TEST MENU, press Enter, and follow the directions on the screen. The hard disk test contains subtests that test the hard disk drive functions.
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3 Tests and Diagnostics 3.12 Hard Disk Test 4. Select the number of the subtest you want to execute and press Enter. The following message will appear. HARD DISK TEST IN PROGRESS XXXXXXX XXX DIAGNOSTIC TEST VX.XX [Ctrl]+[Break] ;test end SUB-TEST [Ctrl]+[C] ;key stop...
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3.12 Hard Disk Test 3 Tests and Diagnostics Subtest 04 Cross talk & peak shift This subtest writes eight types of worst pattern data (listed below) to a cylinder, then reads the data while moving from cylinder to cylinder (to check the data interference in the neighbor track) to compare.
3 Tests and Diagnostics 3.13 Real Timer Test 3.13 Real Timer Test To execute the Real Timer Test, select 9 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. The real timer test contains subtests that test the computer’s real timer functions.
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3.13 Real Timer Test 3 Tests and Diagnostics Subtest 03 Real time carry CAUTION: When this subtest is executed, the current date and time are erased. This subtest checks the real time clock increments. Make sure the date and time are displayed in the following format and they move forward correctly.
3 Tests and Diagnostics 3.14 NDP Test 3.14 NDP Test To execute the NDP test, select 10 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. The NDP test contains one subtest that tests the computer’s NDP functions.
3.15 Expansion Test 3 Tests and Diagnostics 3.15 Expansion Test To execute the expansion test, select 11 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter.
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3 Tests and Diagnostics 3.15 Expansion Test Subtest 03 RGB monitor ID test Connect a CRT monitor to the computer for the test of ID acquisition. To check whether the ID is acquired or not is judged by the data from the monitor.
Move the highlight bar to the subtest you want to execute and press Enter. NOTE: For the subtest 01, 02 and 03, use the TOSHIBA CD-ROM TEST DISK (ZA1217P01/P000204190) for CD-ROM and DVD-ROM TEST DISK TSD-1 for DVD- ROM.
3 Tests and Diagnostics 3.17 Sound/LAN/Modem /TV Test 3.17 Sound/LAN/Modem /TV Test To execute the Sound/LAN/Modem/TV Test, use the Sound/LAN/Modem/TV Test Diagnostics disk. Finish the tests of the main T&D Diagnostics disk by selecting 99 - EXIT TO DIAGNOSTICS MENU in the DIAGNOSTIC TEST MENU. Then in the DIAGNOSTICS MENU, select 9 - EXIT TO MS-DOS.
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3.17 Sound/LAN/Modem /TV Test 3 Tests and Diagnostics Subtest 01 Microphoned recording & play This subtest checks the function of the CODEC A/D D/A converter. Both the microphone and headphone terminals can be checked at the same time. Before executing this subtest, connect an external microphone to the computer. If necessary, connect a headphone to the computer to check whether the headphone jack of the computer is working properly.
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3 Tests and Diagnostics 3.17 Sound/LAN/Modem /TV Test 3-40 Satellite A50/TECRA A2 Maintenance Manual (960-478)
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3.17 Sound/LAN/Modem /TV Test 3 Tests and Diagnostics Subtest 03 LAN Test This subtest checks the operation of mini-PCI I/F by the loopback in the chip. Select 3 to execute and press Enter. The following message will appear: COMPLETED Repeat count = 00000 Error count 00000...
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3 Tests and Diagnostics 3.17 Sound/LAN/Modem /TV Test Subtest 04 Modem Test For this subtest, connect the modem PCB and RJ11 connector with a harness. This subtest contains the following tests. Use the dedicated “FAT-MODE inspection device (product code: QE2000P01 made by Nitto Denki Seisakusyo)”...
3.18 IEEE1394 Test This section describes how to perform the IEEE1394 test with the test program. Toshiba MS-DOS is required to run the DIAGNOSTICS TEST PROGRAM. To start the DIAGNOSTIC TEST PROGRAM, follow these steps: NOTE: Use another computer that can communicate by IEEE1394 (i. Link) cable as a reference machine to perform this test.
3 Tests and Diagnostics 3.19 Wireless LAN Test (Atheros) 3.19 Wireless LAN Test (Atheros) This section describes how to perform the wireless LAN transmitting-receiving test with the test program. NOTE: Use another computer (with Atheros wireless LAN card) that can communicate by the wireless LAN as a responder machine to perform this test.
3.19 Wireless LAN Test (Atheros) 3 Tests and Diagnostics Setting the responder machine NOTE: Release the write-protection of the floppy disk for the test. Insert the first floppy disk containing the test program into the floppy disk drive of the responder machine and turn on the power.
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3 Tests and Diagnostics 3.19 Wireless LAN Test (Atheros) ####################################################################### ######### Askey/Atheros Wireless LAN Module Maintenance T&D ####### ####################################################################### 1 ..DUT mode 2 ..REF mode (Responder) *********************************************************************** ..Press test number [1,2] ? Press 1 and Enter of the tester machine. The test program starts and shows the destination code of the installed wireless LAN card.
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3.19 Wireless LAN Test (Atheros) 3 Tests and Diagnostics When the tester machine has not passed the test, it conducts automatically the test again. When the tester machine still cannot pass the test, the message “NG” will appear in the tester machine. Pressing Enter on the screen shows the message of the cause of error.
3 Tests and Diagnostics 3.20 Wireless LAN Test (Calexico) 3.20 Wireless LAN Test (Calexico) This section describes how to perform the wireless LAN transmitting-receiving test with the test program. To execute the LAN Test, use the Diagnostics disk for wireless LAN test. Finish the tests of the main Diagnostics disk by selecting 99 - EXIT TO DIAGNOSTICS MENU in the DIAGNOSTIC TEST MENU.
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3.20 Wireless LAN Test (Calexico) 3 Tests and Diagnostics This subtest displays SKU information. Confirm if there is no difference between the SKU information appeared on the display and the information of the label on the back of the wireless LAN Card. Press any key and return to the test menu.
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3 Tests and Diagnostics 3.20 Wireless LAN Test (Calexico) Subtest 02 MAC Address Check This subtest displays the MAC address. Press any key and return to the test menu. Subtest 03 11b mode of Calexico 11b/g Card This subtest checks if the wireless LAN antennas of Calexico 11b/g Card are connected and if the communication is operated properly.
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3.20 Wireless LAN Test (Calexico) 3 Tests and Diagnostics NG appears in the display when a problem is found. Press any key, then the following message appears in the display. ************************************************************* Main Antenna Test : NG !! ************************************************************* Press any key and return to the test menu. Subtest 04 communication test of 11g mode This subtest checks if the communication is operated properly in Calexico11g...
3 Tests and Diagnostics 3.21 Thermal Radiation Control Test 3.21 Thermal Radiation Control Test This thermal radiation control test checks the temperature of the CPU and GPU. To execute this test, use the diagnostics disk (thermal radiation control) and follow the procedures below. 1.
3.22 Error Code and Error Status Names 3 Test and Diagnostics Test and Diagnostics 3.22 Error Code and Error Status Names Table 3-2 lists the error codes and error status names for the Diagnostic Test. Table 3-2 Error codes and error status names (1/3) Device name Error code Error status name...
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3 Test and Diagnostics 3.22 Error Code and Error Status Names Table 3-2 Error codes and error status nam es (2/3) Device name Error code Error status name Bad Command Error Address Mark Not Found Write Protected Record Not Found Media Removed DMA Overrun Error DMA Boundary Error...
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3.22 Error Code and Error Status Names 3 Test and Diagnostics Status Error Access Time Out Error No HDD 3-53 Satellite A50/TECRA A2 Maintenance Manual (960 -478)
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3 Test and Diagnostics 3.22 Error Code and Error Status Names Table 3-2 Error codes and error status names (3/3) Device na me Error code Error status name PCMCIA ADDRESS LINE ERROR CE#2 LINE ERROR DATA LINE ERROR WAIT LINE ERROR BSY# LINE ERROR BVD1 LINE ERROR ZV Port ERROR...
3.23 Hard Disk Test Detail Status 3 Test and Diagnostics 3.23 Hard Disk Test Detail Status When an error occurs in the hard disk test, the following message is displayed: HDC status = XXXX Detailed information about the hard disk test error is displayed on the screen by a four-digit number. The hard disk controller error status is composed of two bytes;...
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3 Test and Diagnostics 3.23 Hard Disk Test Detail Status Table 3-4 Error register contents Name Description “0” Not used (Bad block mark) “1” A bad block mark is detected. “0” There is no uncorrectable data error. (Uncorrectable) “1” Uncorrectable data error has been detected. ——...
3.24 FDD Cleaning 3 Test and Diagnostics 3.24 FDD Cleaning 3.24.1 Function Description This function cleans the heads in the 3.5-inch FDD by executing a series of head load/seek and read operations. A cleaning disk is necessary to perform this program. 3.24.2 Operations 1.
3 Test and Diagnostics 3.25 Log Utilities 3.25 Log Utilities 3.25.1 Function Description This function logs error information generated while a test is in progress and stores the results in RAM. This function can store data on a floppy disk or output the data to a display or a printer. If the power switch is turned off, the error information will be lost.
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3.25 Log Utilities 3 Test and Diagnostics 2. The error information displayed on the screen can be manipulated by the following number keys: The 1 key scrolls the display to the next page. The 2 key scrolls the display to the previous page. The 3 key returns to the Diagnostic Menu.
3 Test and Diagnostics 3.26 Running Test 3.26 Running Test 3.26.1 Function Description This function automatically executes the following tests in sequence: 1. System test (subtest 01) 2. Memory test (subtests 01,02,06) 3. Real timer test (subtest 02) 4. Display test (subtest 01) 5.
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3.26 Running Test 3 Test and Diagnostics 4. Select Yes or No and press Enter. The following message will appear: Mount the work disk(s) on the drive(s), then press [Enter] key. [Warning : The contents of the disk(s) will be destroyed] 5.
3 Test and Diagnostics 3.27 Floppy Disk Drive Utilities 3.27 Floppy Disk Drive Utilities 3.27.1 Function Description This function formats the FDD, copies the floppy disk and displays the dump list for both the FDD and HDD. 1. FORMAT NOTE: This program is only for testing a floppy disk drive. The option is different from the MS-DOS FORMAT command.
3.27 Floppy Disk Drive Utilities 3 Test and Diagnostics 3.27.2 Operations 1. Selecting 7 from the DIAGNOSTIC MENU and pressing Enter displays the following message: [ FDD UTILITIES ] 1 - FORMAT 2 - COPY 3 - DUMP 4 - HDD-ID READ 9 - EXIT TO DIAGNOSTICS MENU 2.
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3 Test and Diagnostics 3.27 Floppy Disk Drive Utilities 3. COPY program (a) When COPY is selected, the following message appears: FLOPPY DISK FORMAT & COPY : VX.XX Type select (0:2DD,3:2HD) ? (b) Select a drive type number. Selecting will display a message similar to the 3:2HD one below.
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3.27 Floppy Disk Drive Utilities 3 Test and Diagnostics 4. DUMP program (a) When DUMP is selected, the following message appears: DIAGNOSTICS-HARD DISK & FLOPPY DISK DUMP : VX.XX Drive type select (1:FDD, 2:HDD) ? (b) Select a drive type , the display will go to step (h).
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3 Test and Diagnostics 3.27 Floppy Disk Drive Utilities (j) Set the LBA number you want to dump. The system will access the disk and dump a list. (k) The following message will appear. To finish the dump, select 3. Press number key (1:up,2:down,3:end) ? (l) The following message will appear.
3.28 System Configuration 3 Test and Diagnostics 3.28 System Configuration 3.28.1 Function Description The System Configuration program contains the following configuration information for the computer: 1. Processor Type 2. VGA Controller 3. MS-DOS Version 4. BIOS ROM version (1st ID, 2nd ID) 5.
3 Test and Diagnostics 3.28 System Configuration 3.28.2 Operations 1. Selecting 8 from the DIAGNOSTIC MENU and pressing Enter displays the following system configuration: System Configuration Display : Ver X.XX [Machine Name : XXXXXX] Processor Type XXXXXXXX ** - VGA Controller XXXXX MS-DOS Version VX.XX...
3.29 SETUP 3 Test and Diagnostics 3.29 SETUP 3.29.1 Function Description This program displays the current system setup information as listed below: 1. Memory (a) Total 2. System Date/Time 3. Battery 4. Password 5. Boot Priority (a) Boot Priority (b) HDD Priority (c) Network Boot Protocol 6.
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3 Test and Diagnostics 3.29 SETUP 13. Peripheral (a) Internal Pointing Device (b) External Keyboard “Fn” key (c) Parallel Port Mode (d) Hard Disk Mode 14. LEGACY Emulation (a) USB KB/Mouse Legacy Emulation (b) USB-FDD Legacy Emulation 15. PCI LAN Satellite A50/TECRA A2 Maintenance Manual (960-478) 3-70...
3.29 SETUP 3 Test and Diagnostics 3.29.2 Accessing the SETUP Program Selecting 0 from the DIAGNOSTICS MENU and pressing Enter displays the followings: NOTE: 1. (*1) This depends on model. 2. (*2) This is displayed only for Intel Pentium-M processor model. 3-71 Satellite A50/TECRA A2 Maintenance Manual (960 -478)
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3 Test and Diagnostics 3.29 SETUP Moving Within th e SETUP Menu and Changing Values 1. Press ß and à to move between the two columns. Press to move between items in a column. Press Fn+ PgUp) and Fn + PgDn) to move between the two pages.
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3.29 SETUP 3 Test and Diagnostics SETUP Options The SETUP screen is divided into 15 functionally related groups. This section describes each group and its options. 1. Memory This group of options displays the computer’s memory. (a) Total This field displays the total amount of memory installed and is automatically calculated by the computer.
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3 Test and Diagnostics 3.29 SETUP NOTE: Display of the LCD Brightness will be changed in the condition below: (*1) Operating the battery (*2) Using the AC adapter User Setting Use this option to set the battery save parameters on the sub-window, BATTERY SAVE OPTIONS.
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3.29 SETUP 3 Test and Diagnostics HDD Auto Off Use this option to set the duration of the HDD automatic power off function. xx Min. Automatically turns off the power to the hard disk drive if it is not used for the duration set. The duration xx can be set to 1, 3, 5, 10, 15, 20 or 30 minutes.
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3 Test and Diagnostics 3.29 SETUP 5. Boot Priority (a) Boot Priority Use this option to set the priority for booting of the computer and the priority for the HDD for booting. CD-ROM LAN: The computer looks for bootable files in the following order: FDD, HDD, CD-ROM (*1) and LAN CD-ROM...
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3.29 SETUP 3 Test and Diagnostics 6. Display This group of options configures the computer’s display. (a) Power On Display This option is used to select the display when booting up. Auto-Selected Selects an external monitor if one is connected. Otherwise it selects the internal LCD.
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3 Test and Diagnostics 3.29 SETUP 7. Others Whether or not you need to configure the computer with these options depends primarily on the kind of software or peripherals you use. (a) Power-up Mode Use this option to choose between resume and boot mode. This potion can also be set by hotkeys.
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3.29 SETUP 3 Test and Diagnostics Always Low Disables Pentium M processor featuring Intel SpeedStep technology and always runs the processor at its default speed. (e) Auto Power On This option shows the setting for the Auto Power On function and Wake-up LAN function.
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3 Test and Diagnostics 3.29 SETUP NOTE: 1. Do not remove the AC adaptor and battery pack at the same time when you use this feature. If you do so, data saved by the resume function will be lost. You must also reset this option. 2.
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3.29 SETUP 3 Test and Diagnostics 8. Configuration This option lets you set the device configuration. All Devices BIOS sets all devices. Setup by OS Operating system sets devices that it can control. (Default) NOTE: When using installed OS, selecting “Set by OS” is recommended. But, when setting “PC CARD-Controller Mode”...
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3 Test and Diagnostics 3.29 SETUP (b) Parallel This option sets the interrupt request level and I/O port base address for the parallel port. When the parallel port mode is set to Std. Bi-direct, the options are as follows: LPT setting Interrupt level I/O address LPT 1...
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3.29 SETUP 3 Test and Diagnostics 10. Drives I/O This option displays the address and interrupt level for the hard disk drive, CD/DVD-ROM drive and PC card. It is for information only and cannot be changed. Built-in HDD The setting for the built-in HDD is displayed. CD-ROM The setting for the built-in CD-ROM is displayed.
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Sets the bi-directional setting. This setting should be used with some other parallel devices. NOTE: When using Windows, the setting of “Toshiba HW setup” is enabled and the setting of “Parallel Port Mode” is disabled. Satellite A50/TECRA A2 Maintenance Manual (960-478)
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3.29 SETUP 3 Test and Diagnostics (d) Hard Disk Mode Use this item to select the hard disk mode. Enhanced IDE (normal) Select this mode when the HDD is used for MS-DOS , Windows 95/98/2000/XP , or OS/2 . (Default) Standard IDE Select this mode when using an OS which does not support the Enhanced IDE.
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3 Test and Diagnostics 3.29 SETUP 14. LEGACY EMULATION (a) USB KB/Mouse Legacy Emulation This option sets the Legacy support condition of the USB keyboard and the USB mouse. Enabled Enables support. (Default) LEGACY USB keyboard/USB mouse are available without the driver. Disabled Disables LEGACY support (b) USB-FDD Legacy Emulation...
4.1 Overview 4 Replacement Procedures Overview This chapter describes the procedure for removing and replacing the field replaceable units (FRUs) in the PC. It may not be necessary to remove all the FRUs in order to replace one. The chart below provides a guide as to which other FRUs must be removed before a particular FRU can be removed.
Danger: 1. In the case of the battery, always use authentic parts or equivalent parts approved by Toshiba. Other batteries may have different specifications that are incompatible with the computer and may result in fire or explosion.
4.1 Overview 4 Replacement Procedures Before You Begin Take note of the following points before starting work. Always remove the AC adapter and battery pack before commencing any of the procedures. The procedure for removing the battery pack is described in section “4.2.1 Battery Pack ”. 1.
4 Replacement Procedures 4.1 Overview Disassembly Procedures Three main types of cable connector are used. Pressure plate connector Spring connector Normal pin connector When disconnecting a pressure plate connector, lift up the tag on one side of the plastic pressure plate on the connector and pull the cable out from the connector. When reconnecting a cable to a pressure plate connector, lift up the pressure plate to a suitable height and insert the cable into the connector.
4.1 Overview 4 Replacement Procedures Assembly Procedure After the computer has been disassembled and the part that caused the fault has been repaired or replaced, the computer must be reassembled. Take note of the following general points when assembling the computer. q Take your time and follow the instructions carefully.
4 Replacement Procedures 4.1 Overview Screw Tightening Torque Use the following torque when tightening screws. CAUTION: Overtightening may damage screws or parts. Undertightening may allow screws to loosen (and possibly fall out) causing a short circuit or other damage. NOTE: To tighten screws quickly and accurately, an electric screwdriver is recommended.
4.1 Overview 4 Replacement Procedures Screw Notation To make maintenance of the computer easier, markings of the kinds of the screws including the types and lengths of the screws are indicated on the computer body. Format: Screw shape + Screw length (mm) Screw shape B: Bind screw F: Thin head screw...
4 Replacement Procedures 4.2 Battery Pack/PC Card Battery Pack/PC Card 4.2.1 Battery Pack Removing the battery pack The following describes the procedure for removing the battery pack (See Figure 4-1). CAUTION: Take care not to short circuit the terminals when removing the battery pack.
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There is a danger that the lithium ion battery pack may explode if not fitted, operated, handled, or disposed correctly. Collect the spent battery packs. Use only the batteries approved by Toshiba. NOTE: Check v isually the battery terminals and clean off any dirt with a dry cloth.
4 Replacement Procedures 4.2 Battery Pack/PC Card 4.2.2 PC Card Removing the PC card The following describ es the procedure for removing a PC card (See Figure 4-2). CAUTION: Insert or remove the PC card in accordance with any instructions in the PC card manual or the manuals of the computer system you are using.
4.3 Memory Module 4 Replacement Procedures Memory Module CAUTION: The power of the computer must be turned off when you remove the memory module. Removing a memory module with the power on risks damaging the module or the computer itself. Do not touch the memory module terminals.
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4 Replacement Procedures 4.3 Memory Module 4. Open the left and right latches and remove the memory mo dule. SLOT A: Standard Memory Latch Latch Memory Module SLOT B: Expansion Memory Figure 4-4 Removing Memory Module Installing the memory module Before installing the memory module, confirm that the computer is in boot mode.
4.4 MDC Modem 4 Replacement Procedures MDC Modem Removing the MDC Modem The following describes the procedure for removing an MDC modem (See Figure 4-5). CAUTION:Since the MDC slot cover is easily broken, remove the memory cover first before removing the MDC slot cover. When replacing the MDC mode, The power must be turned off when you remove the MDC modem.
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4 Replacement Procedures 4.4 MDC Modem Installing the MDC Modem The following describes the procedure for installing an MDC modem (See Figure 4-5). 1. Connect the MDC cable to the connector JP1 on the MDC modem. 2. Set the MDC modem on the slot and connect the MDC modem to the connector PJ3020 on the system board by pressing it from the top.
4.5 HDD 4 Replacement Procedures Removing the HDD The following describes the procedure for removing an HDD (See Figure 4-6 to 4-8). CAUTION: Take care not to press on the top or bottom of the HDD. Pressure may cause data loss or damage to the device. 1.
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4 Replacement Procedures 4.5 HDD 3. Pull horizontally the HDD ASSY to disconnect it from the connector and lift up to remove. HDD ASSY HDD slot Figure 4-7 Removing HDD ASSY 4. Remove the following screws fixing the HDD. M3x4S THIN BIND screw 5.
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4.5 HDD 4 Replacement Procedures Installing the HDD The following describes the procedure for installing an HDD (See Figure 4-6 to 4-8). 1. Install the HDD holder to the HDD with the following screws . M3x4S THIN BIND screw 2. Put the HDD ASSY into the HDD slot and connect it to the connector. 3.
4 Replacement Procedures 4.6 Mini PCI Card Mini PCI Card CAUTION: The power must be turned off when you remove a mini PCI card. Removing a mini PCI card with the power on risks damaging the card or the computer itself. Never press hard or bend the mini PCI card.
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4.6 Mini PCI Card 4 Replacement Procedures Glass Tape Wireless LAN Antenna Cable Latches Mini PCI Card Figure 4-10 Removing Mini PCI Card Installing the Mini PCI card The following describes the procedure for installing a mini PCI card (See Figure 4-9, 4-10). 1.
4 Replacement Procedures 4.7 Cooling Fin/CPU Cooling Fin/CPU Removing the Cooling fin/CPU The following describes the procedure for removing the cooling fin/CPU (See Figure 4-11 to 4-14). 1. Remove the following screws fixing the CPU cover and remove the CPU cover. M2.5x14B THIN BIND screw M2.5x18B...
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4.7 Cooling Fin/CPU 4 Replacement Procedures 2. Remove the following screws securing the CPU holder on the CPU. M2x4B BIND screw M2x4B BIND CPU Holder Figure 4-12 Removing CPU Holder Satellite A50/TECRA A2 Maintenance Manual (960-478) 4-21...
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4 Replacement Procedures 4.7 Cooling Fin/CPU 3. Lift up the cooling fin and remove it. Cooling Fin Figure 4-13 Removing Cooling Fin 4. Unlock the CPU by rotating counterclockwise the cam on the CPU socket by 90 degrees with a flat-blade screwdriver (in the order shown in the figure below). 5.
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4.7 Cooling Fin/CPU 4 Replacement Procedures Installing the Cooling fin/CPU The following describes the procedure for installing the cooling fin/CPU (See Figure 4-11 to 4-16). 1. Check that the mark on the cam is in the unlocking position. 2. Attach the CPU to the correct position in the CPU socket. CAUTION: Place the CPU in such direction as shown below.
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4 Replacement Procedures 4.7 Cooling Fin/CPU NOTE: Apply the silicon grease enough to cover the chip surface using the special applicator. When installing the cooling fin, make sure the bottom of the fin covers the top of CPU. CPU Chip Figure 4-16 Applying Silicon Grease 5.
4.8 Keyboard 4 Replacement Procedures Keyboard Removing the Keyboard The following describes the procedure for removing the keyboard (See Figure 4-17 to 4-19). CAUTION: As the keytop may fall out, when handling the keyboard always hold it by the frame and do not touch the keytop. 1.
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4 Replacement Procedures 4.8 Keyboard 3. Remove the following screws holding the keyboard. M2.5 2.8B THIN BIND screw 4. Remove the following screw fixing the keyboard hold plate and remove the keyboard hold plate by pulling it to the right side. M2.5 2.8B THIN BIND screw 5.
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4.8 Keyboard 4 Replacement Procedures 6. Remove the following screw fixing the keyboard support plate underneath the keyboard. M2.5x8B THIN BIND screw 7. Remove the keyboard support plate. M2.5x8B THIN BIND Keyboard Support Plate Keyboard Flexible Cable PJ3230 Keyboard Figure 4-19 Removing Keyboard Support Plate 8.
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4 Replacement Procedures 4.8 Keyboard Installing the Keyboard The following describes the procedure for installing the keyboard (See Figure 4-17 to 4-19). 1. Place the keyboard on the palm rest as its face is down. Connect the keyboard flexible cable to the connector PJ3230 on the system board. 2.
4.9 Switch Board 4 Replacement Procedures Switch Board Removing the Switch board The following describes the procedure for removing the switch board (See Figure 4-20). 1. Open the display and unlock the connector. Disconnect the switch board cable from the connector on the system board. 2.
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4 Replacement Procedures 4.9 Switch Board Installing the Switch board The following describes the procedure for installing the switch board (See Figure 4-20). 1. Connect the s witch board cable to the connector PJ3280 on the switch board. 2. Place the switch board to the left side of the installation position and slide it to the right to install.
4.10 Optical Drive 4 Replacement Procedures 4.10 Optical Drive This section describes how to remove and install a DVD-ROM drive as an example. The procedure for a CD-ROM, DVD-ROM & CD-R/RW, DVD-R/-RW or DVD Super Multi drive is the same. NOTE: Do not apply excessive force to the top of an optical drive.
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4 Replacement Procedures 4.10 Optical Drive 3. Remove the following screws fixing the rear bracket from the DVD-ROM drive assembly. M2x2.7 STEP screw 4. Remove the following screw fixing the side bracket and remove the side bracket. M2x3S SUPER THIN BIND screw DVD-ROM Drive Assembly Side Bracket Rear Bracket...
4.11 Display Assembly 4 Replacement Procedures 4.11 Display Assembly Removing the Display assembly The following describes the procedure for removing the display assembly (See Figure 4-23 to 4-25). 1. Close the display and turn the computer face down. 2. Remove the following screws from the bottom of the computer. M2.5x6B THIN BIND screw x9 (“6”...
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4 Replacement Procedures 4.11 Display Assembly 3. Turn the computer face up. Open the display and disconnect the LCD cable and the speaker cables (Blue, Red) from the connectors on the system board. Unlock the connector and disconnect the touch pad cable from the system board. 4.
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4.11 Display Assembly 4 Replacement Procedures 5. (For wireless LAN models only) Pull out the wireless LAN cables from the slot near the center of the base assembly. NOTE: (For wireless LAN models only) When removing the display assembly, be careful not to cut or scratch the wireless LAN cables.
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4 Replacement Procedures 4.11 Display Assembly Installing the Display assembly The following describes the procedure for installing the display assembly (See Figure 4-23 to 4-25). 1. (For wireless LAN models only) Pass the wireless LAN cables through the slot near the center of the base assembly. 2.
4.12 Sound Board 4 Replacement Procedures 4.12 Sound Board Removing the Sound Board The following describes the procedure for removing the sound board (See Figure 4-26). 1. Unlock the connector and disconnect the sound board cable from the connector of the system board.
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4 Replacement Procedures 4.12 Sound Board 3. Connect the sound board cable to the connector PJ9500 on the system board. 4-38 Satellite A50/TECRA A2 Maintenance Manual (960-478)
4.13 Connector Board 4 Replacement Procedures 4.13 Connector Board This section describes how to remove and install a connector board with drawings of the board with parallel port (parallel port type) as an example. The procedure for a connector board with TV jack is the same. Removing the Connector Board The following describes the procedure for removing the Connector Board (See Figure 4-27, 4-28).
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4 Replacement Procedures 4.13 Connector Board M2.5x2.8S THIN BIND Connector Board PJ3502 or PJ5640 PJ4610 USB I/F Cable Core DC-IN Cable Connector Board Cable Figure 4-28 Removing Connector Board Installing the Connector Board The following describes the procedure for installing the connector board (See Figure 4-27, 4- 28).
4.14 Fan 4 Replacement Procedures 4.14 Fan Removing the Fan The follo wing describes the procedure for removing the fan (See Figure 4-29). 1. Disconnect the fan cable from the connector on the system board. 2. Remove the following screws and remove the fan module by raising it up. M2.5x4B THIN BIND screw M2.5x4B THIN BIND...
4 Replacement Procedures 4.15 System Board/DC-IN Jack/RTC Battery 4.15 System Board/DC-IN Jack/RTC Battery CAUTION: When handling the system board, always hold by the edges. Do not touch the printed circuit face. After replacing the system board with a new one, set the DMI information as described in section 3.4 “System test”.
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4.15 System Board/DC-IN Jack/RTC Battery 4 Replacement Procedures 2. Take out the RTC battery from the RTC battery case. 3. Push a little the LAN jack and MODEM jack from the outside and raise them to remove from the base assembly. 4.
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4 Replacement Procedures 4.15 System Board/DC-IN Jack/RTC Battery Installing the System board/DC-IN jack/RTC battery The following describes the procedure for installing the system board/DC-IN jack/RTC battery (See Figure 4-30, 4-31). 1. Connect the MODEM cable to the connector PJ3021 and the LAN cable to PJ4100 on the back of the system board and secure them with two glass tapes.
4.16 Battery Latch 4 Replacement Procedures 4.16 Battery Latch Removing the Battery latch The following describes the procedure for removing the battery latch (See Figure 4-32, 4-33). 1. While pressing projections of the SB latch button inside each other, push the SB latch button to the bottom of the base assembly to remove.
4 Replacement Procedures 4.16 Battery Latch Installing the Battery latch The following describes the procedure for installing the battery latch (See Figure 4-32, 4-33). 1. Set the spring to the battery lock L and install it on the base assembly. 2.
4.17 Battery Lock 4 Replacement Procedures 4.17 Battery Lock Removing the Battery lock The following describes the procedure for removing the battery lock (See Figure 4-34, 4-35). 1. While pressing projections of the battery lock button inside each other, push the button to the bottom of the base assembly to remove.
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4 Replacement Procedures 4.17 Battery Lock Installing the Battery lock The following describes the procedure for installing the battery latch (See Figure 4-34, 4-35). 1. Set the spring to the battery lock R and install it on the base assembly. 2.
4.18 Touch Pad 4 Replacement Procedures 4.18 Touch Pad Removing the Touch pad The following describes the procedure for removing the touch pad (See Figure 4-36). 1. Remove the following screws securing the touch pad. M2.5x4B THIN BIND screw 2. Remove the touch pad and touch pad switch by raising. M2.5x4B THIN BIND Touch Pad Cable Touch Pad...
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4 Replacement Procedures 4.18 Touch Pad Installing the Touch pad The following describes the procedure for installing the touch pad (See Figure 4-36). 1. Place the touch pad switch fitting to bosses. 2. Place the touch pad according to the guide pins. 3.
4.19 LCD Unit/FL Inverter 4 Replacement Procedures 4.19 LCD Unit/FL Inverter Removing the LCD unit/FL inverter The follo wing describes the procedure for removing the LCD unit and FL inverter (See Figure 4-37 to 4-40). 1. Peel off two mask seals from the front of the display mask and remove the following screws .
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4 Replacement Procedures 4.19 LCD Unit/FL Inverter 3. Remove the following screw fixing the FL inverter. M2x4Z SUPER THIN BIND screw 4. Peel off the insulator and disconnect two cables from the FL inverter. Remove the FL inverter. 5. Remove the following screws fixing the LCD unit. M2x4Z SUPER THIN BIND screw 6.
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4.19 LCD Unit/FL Inverter 4 Replacement Procedures 8. Remove the following screws securing the LCD brackets. Remove the LCD brackets from the LCD module . M2x3 SUPER THIN BIND screw M2x3C SUPER THIN BIND LCD Bracket M2x3C SUPER THIN BIND Figure 4-39 Removing LCD Bracket 9.
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4 Replacement Procedures 4.19 LCD Unit/FL Inverter Installing the FL inverter/LCD unit The following describes the procedure for installing the LCD unit/FL inverter (See Figure 4- 37 to 4-40). 1. (For 14.1-inch LCD made by Samsung only) Attach the aluminum tape on the LCD unit. CAUTION: When attaching the aluminum tape, be careful with the followings: * Right of back of the LCD (enlarged view) Fit the edge of LCD to the bending...
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4.19 LCD Unit/FL Inverter 4 Replacement Procedures * Right side of the LCD (enlarged view) Bend the aluminum tape to the top. * Caution on attaching the aluminum tape Attach the aluminum tape without cover any part of bar codes above. 2.
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4 Replacement Procedures 4.19 LCD Unit/FL Inverter 3. Stand the LCD unit on the display cover and connect the LCD cabl e to the back of the LCD. Fix it with the glass tape . CAUTION: (For 14.1-inch LCD made by Samsung only) For fixing the LCD cable, use the copper tape instead of the glass tape.
4.20 Latch Assembly 4 Replacement Procedures 4.20 Latch Assembly Removing the Latch assembly The following describes the procedure for removing latch assembly (See Figure 4-41). 1. Press the latch assembly in the direction indicated by arrow to remove it from the display cover.
4 Replacement Procedures 4.21 Wireless LAN Antenna/Speaker/Hinge 4.21 Wireless LAN Antenna/Speaker/Hinge Removing the Wireless LAN antenna/Speaker/Hinge The following describes the procedure for removing the wireless LAN antenna, speaker and hinge (See Figure 4-42 to 4-49). 1. (Wireless LAN models only) Peel off five acetate tapes securing the white and the black wireless LAN antenna cables.
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4.21 Wireless LAN Antenna/Speaker/Hinge 4 Replacement Procedures 2. Remove the following screw securing the LCD cable holder to remove it. M2x4Z SUPER THIN screw M2x4Z SUPER THIN LCD Cable Holder Hinge Cap Fit the red line of the LCD cable to the edge of the hinge cap.
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4 Replacement Procedures 4.21 Wireless LAN Antenna/Speaker/Hinge 5. Remove the following screws securing the hinge caps . M2.5x6B THIN BIND screw 6. Take out the LCD cable under the insulator. 7. (Wireless LAN models only) Remove the wireless LAN antenna cable. M2.5x6B THIN BIND Hinge Cap...
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4.21 Wireless LAN Antenna/Speaker/Hinge 4 Replacement Procedures 8. Remove the following screws securing the optical drive cover from the back of the display assembly. To remove the optical drive cover, pull it out to the right hinge first. M2x2.8B THIN BIND screw M2x4B THIN BIND screw M2x2.8B...
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4 Replacement Procedures 4.21 Wireless LAN Antenna/Speaker/Hinge 9. Remove the following screws securing the hinges to the display assembly. M2x4B THIN BIND screw x3 (Right:2, Left: 1) 10. Peel off the glass tapes securing the speaker cables and take out the cable under the insulator.
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4.21 Wireless LAN Antenna/Speaker/Hinge 4 Replacement Procedures 11. Remove the following screws securing the speakers. M2. 5x6B THIN BIND screw CAUTION: When removing the speakers, be careful not to touch the metal part of the speakers. It might damage the speakers. 12.
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4 Replacement Procedures 4.21 Wireless LAN Antenna/Speaker/Hinge 13. Shift the hinges inside and pull out them to remove. Hinge Figure 4-49 Removing Hinges (2) 4-64 Satellite A50/TECRA A2 Maintenance Manual (960-478)
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4.21 Wireless LAN Antenna/Speaker/Hinge 4 Replacement Procedures Installing the Wireless LAN antenna/Speaker/Hinge The following describes the procedure for installing the wireless LAN antenna, speaker and hinge (See Figure 4-42 to 4-50). CAUTION: When installing the speakers, be careful not to touch the metal part of the speakers.
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4 Replacement Procedures 4.21 Wireless LAN Antenna/Speaker/Hinge 7. Install the display cover on the display assembly and secure the hinges and the display cover with the following screws . M2.5x6C PSP TIGHT screw M1.5x5C SUPER THIN screw x2 8. (For wireless LAN models only) Fit the wireless LAN antennas to the lines on the back side of the display cover with double-sided adhesive tapes.
Appendices Appendix Contents Appendix A Handling the LCD Module................A-1 Appendix B Board Layout....................B-1 System Board Front View................B-1 System Board Back View ................B-3 Sound Board (FLKSN*) ................B-5 Appendix C Pin Assignment .....................C-1 System Board PJ1400 Memory 0 Connector (200-pin) ............C-1 PJ1401 Memory 1 Connector (200-pin) ............
Apx. A Handling the LCD Module Appendices Apx. A Appendix A Handling the LCD Module Precautions for handling the LCD module The LCD module can be easily damaged during assembly or disassembly. Observe the following precautions when handling the LCD module: 1.
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Appendices Apx. A Handling the LCD Module 3. If the panel’s surface gets dirty, wipe it with cotton or a soft cloth. If it is still dirty, try breathing on the surface to create a light condensate and wipe it again. If the surface is very dirty, we recommend a CRT cleaning age nt.
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Apx. A Handling the LCD Module Appendices 5. Glass is used in the panel, so be careful not to drop it or let it strike a hard object, which could cause breakage or cracks. 6. CMOS-LSI circuits are used in the module, so guard against damage from electrostatic discharge.
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Appendices Apx. A Handling the LCD Module 7. Do not expose the module to direct sunlight or strong ultraviolet rays for long periods. 8. Do not store the module at temperatures below specifications. Cold can cause the liquid crystals to freeze, lose their elasticity or otherwise suffer damage. 9.
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Apx. A Handling the LCD Module Appendices 10. If you transport the module, do not use packing material that contains epoxy resin (amine) or silicon glue (alcohol or oxime). These materials can release gas that can damage the panel’s polarization. Satellite A50/TECRA A2 Maintenance Manual (960-478)
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Appendices Apx. A Handling the LCD Module Satellite A50/TECRA A2 Maintenance Manual (960-478)
Apx. B Board Layout Appendices Apx. B Appendix B Board Layout System Board Front View Figure B-1 System board layout (front) Satellite A50/TECRA A2 Maintenance Manual (960-478)
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Appendices Apx. B Board Layout Table B-1 System board ICs and connectors (front) Mark Number Name PJ3502 Parallel I/F connector PJ5640 Connector board (FLKCS*) connector PJ3230 Keyboard I/F connector PJ6001 Left Speaker I/F connector PJ6002 Right Speaker I/F connector PJ9500 Sound board (FLKSN*) connector PJ1800 HDD I/F connector...
Apx. C Pin Assignment Appendices Connector Board (TV Board) (FLKCS*) C.37 PJ4610 USB on System Board Connector (8-pin) Table C -37 USB on system board connector pin assignment (8-pin) Pin No. Signal name Pin No. Signal Name USBP0-S3N USBP0-S3P USBP0-4 USBP0-5 USBP3-S3N USBP3-S3P...
Appendices Apx. C Pin Assignment C.40 PJ5640 System Board I/F Connector (5-pin) Table C-40 System board I/F Connector pin assignment (5-pin) Pin No. Signal name Pin No. Signal Name CHROMA LUMINANCE C.41 PJ5641 TV Connector (4-pin) Table C-41 TV Connector pin assignment (4-pin) Pin No.
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Appendix D Keyboard Scan/Character Codes Appendices Appendix D Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (1/4) Code set 1 Code set 2 Keytop Note Make Break Make Break ‘ ~ 7 & BkSp Satellite A50/TECRA A2 Maintenance Manual (960-478)
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Appendices Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (2/4) Code set 1 Code set 2 Keytop Note Make Break Make Break Caps Lock ‘ “ Enter Shift (L) No.102 , < . > Shift (R) Satellite A50/TECRA A2 Maintenance Manual (960-478)
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Appendix D Keyboard Scan/Character Codes Appendices Table D-1 Scan codes (set 1 and set 2) (3/4) Code set 1 Code set 2 Keytop Note Make Break Make Break Ctrl Alt (L) Space ALT (R) Home PgUp PgDn Satellite A50/TECRA A2 Maintenance Manual (960-478)
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Appendices Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (4/4) Code set 1 Code se t 2 Keytop Note Make Break Make Break PrintSc Pause — — — — Notes: 1. * Scan codes differ by mode. 2.
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Appendix D Keyboard Scan/Character Codes Appendices Table D-2 Scan codes with left Shift key Code set 1 Code set 2 Make Break Make Break AA E0 35 E0 B5 E0 2A E0 F0 12 4A E0 F0 4A E0 12 AA E0 52 E0 D2 E0 2A E0 F0 12 70 E0 F0 70 E0 12...
Appendix D Keyboard Scan/Character Codes Appendices Table D-5 Scan codes in overlay mode Code set 1 Code set 2 Keytop Make Break Make Break (–) Table D-6 No.124 key scan code Code set 1 Code set 2 Shift Make Break Make Break Prt Sc...
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Appendices Appendix D Keyboard Scan/Character Codes Table D-7 No.126 key scan code Shift Code set 1 Code set 2 Make Make Pause Common* E1 E1 F0 Ctrl* E0 F0 *: This key generates only make codes. Satellite A50/TECRA A2 Maintenance Manual (960-478)
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Apx. G BIOS/KBC/EC Update Appendices Apx. G BIOS Rewrite Procedures Appendix G BIOS/KBC/EC Update To update the BIOS, KBC or EC, insert the FD for update into the FDD. Then turn on the power of the computer while pressing the following key until the power LED blinks. For BIOS update: (tilde key ;...
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Apx. H Reliability Appendices Apx. H Reliability Appendix H Reliability The following table shows the MTBF (Mean Time Between Failures) of system. Table H-1 MTBF Component Time (hours) System 6,822 (Docking port is not supported.) System 6,873 (Docking port is supported.) Satellite A50/TECRA A2 Maintenance Manual (960-478)