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Exchange
Current Fuse
Upper stage
fan motor
Card spacer
Push this in the direction of the
arrow to unlock and remove the
P.C. board assembly.
Evenly apply the silicon heat sink compound to the heat-sink
surfaces of the IPM and rectifier devices.
Caution: It must be ensured that no dust, etc. adheres to the
heat-sink surfaces of the IPM and rectifier devices.
Standard for heat silicone heat sink compound:
Manufacturer: Shin-Etsu Chemical Co., Ltd.
Type: G746
172
Lower stage
fan motor
Card spacer
Screw (M3x20)
Used to secure the
rectifier and IPM devices
Screw tightening
torque:0.55±0.1N/m
Upper stage
Lower stage
fan motor
fan motor
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- Service Manual
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Table of Contents
Troubleshooting
